Datasheet

DS_1903_032 73M1903 Data Sheet

Rev. 2.1 47

Revision History

Rev. #

Date

Comments

1.0 4/16/2004 First publication.

1.1 12/13/2004 Minor format modification.

1.2 7/15/2005 Company logo change and minor format modification.

1.4 9/14/2006 Corrected QFN pin-out drawing.

1.5 5/23/2007 Added 20-VT package information.

1.6 12/14/2007 Changed 32-QFN from punched to SAWN.

Removed the leaded package option.

1.7 1/17/2008 Changed the bottom view package dimension for 32-QFN package.

2.0 2/23/2009 Removed all references to the 32-pin TQFP package.

Formatted to the new corporate standard.

2.1 3/9/2010 Added the schematic and bill of materials in Section 10.

Formatted to the new corporate standard.

Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.

Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.

MicroDAA is a registered trademark of Teridian Semiconductor Corporation.

All other trademarks are the property of their respective owners.

Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly

contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms

and Conditions. The company assumes no responsibility for any errors which may appear in this

document, reserves the right to change devices or specifications detailed herein at any time without

notice and does not make any commitment to update the information contained herein. Accordingly, the

reader is cautioned to verify that this document is current by comparing it to the latest version on

http://www.teridian.com or by checking with your sales representative.

Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618

TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com