Datasheet

DS_6612_001 78M6612 Data Sheet
Rev 2 29
4.2 Recommended External Components
Table 6: Recommended External Components
Name
From
To
Function
Value
Unit
C1 V3P3A AGND
Bypass capacitor for 3.3V supply.
≥0.1±20% µF
C2 V3P3D DGND
Bypass capacitor for 3.3V output.
0.1±20% µF
CSYS V3P3SYS DGND
Bypass capacitor for V3P3SYS.
≥
1.0
±
30%
µ
F
C2P5 V2P5 DGND
Bypass capacitor for V2P5.
0.1±20% µF
XTAL XIN XOUT 32.768 kHz crystal – electrically similar to
ECS .327-12.5-17X or Vishay XT26T, load
capacitance 12.5 pF.
32.768 kHz
CXS
†
XIN AGND Load capacitor for crystal (exact value
depends on crystal specifications and
parasitic capacitance of board).
27±10%
pF
CXL
†
XOUT AGND
27±10%
pF
†
Depending on trace capacitance, higher or lower values for CXS and CXL must be used. Capacitance
from XIN to GNDD and XOUT to GNDD (combining pin, trace and crystal capacitance) should be 35 pF
to 37 pF.
4.3 Recommended Operating Conditions
Table 7: Recommended Operation Conditions
Parameter Condition Min Typ Max Unit
V3P3SYS, V3P3A: 3.3V Supply Voltage
V3P3A and V3P3SYS must be at the
same voltage
Normal Operation 3.0 3.3 3.6 V
Battery Backup 0 3.6 V
VBAT No Battery Externally Connect to V3P3SYS
Battery Backup
BRN and LCD modes
SLEEP mode
3.0
2.0
3.8
3.8
V
V
Operating Temperature -40 +85 ºC