Datasheet

DS1218
2 of 7
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground -0.5V to +7.0V
Operating Temperature Range 0°C to +70°C
Storage Temperature Range -55°C to +125°C
Soldering Temperature (reflow, SO) +260°C
Lead Temperature (soldering, 10s) +300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of
time may affect reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (θ
JA
).…………………...……………………....110°C/W
Junction-to-Case Thermal Resistance (θ
JC
)…………………………………………………40°C/W
SO
Junction-to-Ambient Thermal Resistance (θ
JA
).…………………………………………...136°C/W
Junction-to-Case Thermal Resistance (θ
JC
)…………………………………………………38°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board for the SO. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
RECOMMENDED OPERATING CONDITIONS (0°C to +70°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Supply
V
CCI
4.5
5.0
5.5
V
2
Logic 1
V
IH
2.0
5.5
V
2
Logic 0
V
IL
-0.3
0.8
V
2
Battery Supply
V
BAT
2.5
3.0
3.5
V
2
DC ELECTRICAL CHARACTERISTICS (0°C to +70°C; V
CCI
= 5V ± 10%)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Active Current
I
CCI
2
5
mA
4
Battery Current
I
BAT
100
nA
4, 5
RAM Current
(V
CCO1
≥ V
CCI
-0.3V)
I
CCO
80
mA
6
RAM Current
(V
CCO
≥ V
CCI
-0.2V)
I
CCO
70
mA
Input Leakage
I
IL
-1.0
+1.0
µA
CEO
Output @ 2.4V
I
OH
-1.0
mA
CEO
Output @ 0.4V
I
OL
4.0
mA
V
CC
Trip Point
V
CCTP
1.26xV
BAT
CAPACITANCE (T
A
= +25°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Input Capacitance
C
IN
5
pF
Output Capacitance
C
OUT
7
pF