Datasheet

ManualsBrandsMAXIM INTEGRATED ManualsIntegrated Circuits (ICs)Timer IC t- real time clock Clock/calendar PowerCap 34 (modules)

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FEATURES

 Integrated NV SRAM, Real-Time Clock,

Crystal, Power-Fail Control Circuit and

Lithium Energy Source

 Clock Registers are Accessed Identically to the

Static RAM. These Registers Reside in the

Eight Top RAM Locations.

 Totally Nonvolatile with Over 10 Years of

Operation in the Absence of Power

 Access Times of 85ns and 100ns

 BCD-Coded Year, Month, Date, Day, Hours,

Minutes, and Seconds with Leap Year

Compensation Valid Up to 2100

 Power-Fail Write Protection Allows for ±10%

Power Supply Tolerance

 Lithium Energy Source is Electrically

Disconnected to Retain Freshness Until Power

is Applied for the First Time

 DS1643 Only (DIP Module)

Standard JEDEC Byte-Wide 8K x 8 RAM

Pinout

 UL Recognized

 DS1643P Only (PowerCap Module Board)

Surface Mountable Package for Direct

Connection to PowerCap Containing

Battery and Crystal

Replaceable Battery (PowerCap)

Power-Fail Output

Pin-for-Pin Compatible with Other Densities of

DS164XP Timekeeping RAM

PIN CONFIGURATIONS

ORDERING INFORMATION

PART

VOLTAGE RANGE

(V)

TEMP RANGE PIN-PACKAGE TOP MARK

DS1643-85+

5.0 0°C to +70°C

28 EDIP (0.740) DS1643+85

DS1643-100+

5.0 0°C to +70°C

28 EDIP (0.740) DS1643+100

DS1643P-85+

5.0 0°C to +70°C

34-PowerCap* DS1643P+85

DS1643P-100+

5.0 0°C to +70°C

34-PowerCap* DS1643P+100

*DS9034I-PCX+ and DS9034-PCX+ required (must be ordered separately).

+Denotes a lead(Pb)-free/RoHS-compliant package. The top mark will include a “+” symbol on lead-free devices.

DS1643/DS1643P

Nonvolatile Timekeeping RAMs

www.maxim-ic.com

Encapsulated DIP

(700-mil Extended)

DQ0

DQ1

GND

DQ2

CE2

A11

A10

DQ7

DQ6

DQ5

DQ3

DQ4

A12

N.C.

DS1643

N.C.

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

GND

N.C.

A12

A11

A10

N.C.

X1 GND V

BAT

PowerCap Module Board

(Uses DS9034PCX PowerCap)

DS1643P

TOP VIEW

19-5058; Rev 5/10

Summary of content (17 pages)

PAGE 1
9-5058; Rev 5/10 DS1643/DS1643P Nonvolatile Timekeeping RAMs www.maxim-ic.com FEATURES PIN CONFIGURATIONS  Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit and Lithium Energy Source  Clock Registers are Accessed Identically to the Static RAM. These Registers Reside in the Eight Top RAM Locations.
PAGE 2
DS1643/DS1643P PIN DESCRIPTION PDIP 1 2 3 4 5 6 7 8 9 10 21 23 24 25 11 12 13 15 16 17 18 19 20 22 26 27 28 PIN PowerCap 1, 2, 3, 31–34 30 25 24 23 22 21 20 19 18 28 29 27 26 16 15 14 13 12 11 10 9 8 7 — 6 5 NAME N.C.
PAGE 3
DS1643/DS1643P DESCRIPTION The DS1643 is an 8K x 8 nonvolatile static RAM with a full function Real Time Clock (RTC) that are both accessible in a byte-wide format. The nonvolatile timekeeping RAM is functionally equivalent to any JEDEC standard 8K x 8 SRAM. The device can also be easily substituted in ROM, EPROM and EEPROM sockets providing read/write nonvolatility and the addition of the real time clock function. The real time clock information resides in the eight uppermost RAM locations.
PAGE 4
DS1643/DS1643P Figure 1. Block Diagram DS1643/ DS1643P Table 1. Truth Table VCC CE 5V 10% <4.5V > VBAT
PAGE 5
DS1643/DS1643P CLOCK ACCURACY (DIP MODULE) The DS1643 is guaranteed to keep time accuracy to within 1 minute per month at 25C. CLOCK ACCURACY (POWERCAP MODULE) The DS1643P and DS9034PCX are each individually tested for accuracy. Once mounted together, the module is guaranteed to keep time accuracy to within 1.53 minutes per month (35ppm) at 25C. Table 2.
PAGE 6
DS1643/DS1643P DATA RETENTION MODE When VCC is within nominal limits (VCC > 4.5V) the DS1643 can be accessed as described above with read or write cycles. However, when VCC is below the power-fail point VPF (point at which write protection occurs) the internal clock registers and RAM are blocked from access. This is accomplished internally by inhibiting access via the CE signal.
PAGE 7
DS1643/DS1643P ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………………..-0.3V to +6.0V Operating Temperature Range………………………………………………0°C to +70°C, Noncondensing Storage Temperature (EDIP) ……………………………………………-40°C to +85°C, Noncondensing Storage Temperature (PowerCap) ………………………………………-55°C to +125°C, Noncondensing Lead Temperature (soldering, 10 seconds)………………………… . . . . . . . . . . . . . . . . . . . . ……+260°C Note: EDIP is hand or wave-soldered only (Note 7).
PAGE 8
DS1643/DS1643P AC CHARACTERISTICS—READ CYCLE (VCC = 5.0V 10%, TA = 0C to +70C.
PAGE 9
DS1643/DS1643P AC CHARACTERISTICS—WRITE CYCLE (VCC = 5.0V 10%, TA = 0C to +70C.
PAGE 10
DS1643/DS1643P WRITE CYCLE TIMING DIAGRAM—WE CONTROLLED WRITE CYCLE TIMING DIAGRAM— CE , CE2 CONTROLLED 10 of 17
PAGE 11
DS1643/DS1643P POWER-UP/DOWN AC CHARACTERISTICS (VCC = 5.0V 10%, TA = 0C to +70C.
PAGE 12
DS1643/DS1643P AC TEST CONDITIONS Output Load: 100pF + 1TTL Gate Input Pulse Levels: 0 to 3.0V Timing Measurement Reference Levels: Input: 1.5V Output: 1.5V Input Pulse Rise and Fall Times: 5ns NOTES: 1) Voltages are referenced to ground. 2) Typical values are at +25C and nominal supplies. 3) Outputs are open. 4) The CE2 control signal functions exactly the same as the CE signal except that the logic levels for active and inactive levels are opposite. 5) Data retention time is at 25C.
PAGE 13
DS1643/DS1643P DS1643 28-PIN PACKAGE PKG DIM A IN. MM B IN. MM C IN. MM D IN. MM E IN. MM F IN. MM G IN. MM H IN. MM J IN. MM K IN. MM 13 of 17 28-PIN MIN MAX 1.470 1.490 37.34 37.85 0.675 0.740 17.75 18.80 0.315 0.335 8.51 9.02 0.075 0.105 1.91 2.67 0.015 0.030 0.38 0.76 0.140 0.180 3.56 4.57 0.090 0.110 2.29 2.79 0.590 0.630 14.99 16.00 0.010 0.018 0.25 0.45 0.015 0.025 0.43 0.
PAGE 14
DS1643/DS1643P DS1643P PKG DIM A B C D E F G MIN 0.920 0.980 0.052 0.048 0.015 0.025 INCHES NOM 0.925 0.985 0.055 0.050 0.020 0.027 MAX 0.930 0.990 0.080 0.058 0.052 0.025 0.030 NOTE: MAXIM RECOMMENDS THAT POWERCAP MODULE BASES EXPERIENCE ONE PASS THROUGH SOLDER REFLOW ORIENTED WITH THE LABEL SIDE UP (“LIVEBUG”). HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR APPLY THE SOLDERING IRON TO LEADS FOR MORE THAN 3 SECONDS. TO SOLDER, APPLY FLUX TO THE PAD, HEAT THE LEAD FRAME PAD AND APPLY SOLDER.
PAGE 15
DS1643/DS1643P DS1643P WITH DS9034PCX ATTACHED PKG DIM A B C D E F G 15 of 17 MIN 0.920 0.955 0.240 0.052 0.048 0.015 0.020 INCHES NOM 0.925 0.960 0.245 0.055 0.050 0.020 0.025 MAX 0.930 0.965 0.250 0.058 0.052 0.025 0.
PAGE 16
DS1643/DS1643P RECOMMENDED POWERCAP MODULE LAND PATTERN PKG DIM A B C D E 16 of 17 MIN - INCHES NOM 1.050 0.826 0.050 0.030 0.
PAGE 17
DS1643/DS1643P REVISION HISTORY REVISION DATE 12/09 5/10 DESCRIPTION Corrected the lead(Pb)-free part information for the -100+ versions in the Ordering Information table.