Datasheet

ManualsBrandsMAXIM INTEGRATED ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller SIMM 40 8-Bit 16 MHz I/O number 32

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DESCRIPTION

The DS2250(T) soft microcontroller module is a

fully 8051-compatible 8-bit CMOS microcontroller that

offers “softness” in all aspects of its application.

This is accomplished through the comprehensive

use of nonvolatile technology to preserve all

information in the absence of system V

. The

internal program/data memory space is

implemented using 8, 32, or 64kbytes of nonvolatile

CMOS SRAM. Furthermore, internal data registers

and key configuration registers are also nonvolatile.

An optional real-time clock gives permanently

powered timekeeping. The clock keeps time to a

hundredth of a second using an on-board crystal.

All nonvolatile memory and resources are

maintained for over 10 years at room temperature in

the absence of power.

PIN CONFIGURATION

FEATURES

 8-Bit 8051-Compatible Microcontroller

Adapts to Task-At-Hand

8, 32, or 64kbytes of Nonvolatile RAM for

Program and/or Data Memory Storage

Initial Downloading of Software in End System

via On-Chip Serial Port

Capable of Modifying its Own Program and/or

Data Memory in End Use

 High-Reliability Operation

Maintains All Nonvolatile Resources Up to 10

Years in the Absence of V

at Room

Temperature

Power-Fail Reset

Early Warning Power-Fail Interrupt

Watchdog Timer

 Software Security Feature

Executes Encrypted Software to Prevent

Unauthorized Disclosure

 On-Chip, Full-Duplex Serial I/O Ports

 Two On-Chip Timer/Event Counters

 32 Parallel I/O Lines

 Compatible with Industry Standard 8051

Instruction Set

 Permanently Powered Real-Time Clock

Operating information is contained in the Secure Microcontroller

User’s Guide. This data sheet provides ordering information,

pinout, and electrical specifications.

ORDERING INFORMATION

PART RAM SIZE (kB) MAX CRYSTAL SPEED (MHz) TIMEKEEPING?

DS2250-32-16 32 16 No

DS2250-32-16+ 32 16 No

DS2250-64-16 64 16 No

DS2250-64-16# 64 16 No

DS2250T-32-16 32 16 Yes

DS2250T-32-16+ 32 16 Yes

DS2250T-64-16 64 16 Yes

DS2250T-64-16+ 64 16 Yes

+ Denotes lead-free/RoHS-compliant package

# Denotes RoHS-compliant device that may contain lead exempt under the RoHS requirements.

DS2250(T)

Soft Microcontroller Module

www.maxim-ic.com

1 20 21 40

40-Pin SIMM

DS2250

(

)

Summary of content (18 pages)

PAGE 1
DS2250(T) Soft Microcontroller Module www.maxim-ic.com DESCRIPTION FEATURES The DS2250(T) soft microcontroller module is a fully 8051-compatible 8-bit CMOS microcontroller that offers “softness” in all aspects of its application. This is accomplished through the comprehensive use of nonvolatile technology to preserve all information in the absence of system VCC. The internal program/data memory space is implemented using 8, 32, or 64kbytes of nonvolatile CMOS SRAM.
PAGE 2
DS2250(T) DS2250(T) BLOCK DIAGRAM Figure 1 2 of 18
PAGE 3
DS2250(T) PIN DESCRIPTION PIN 1, 3, 5, 7, 9, 11, 13, 15 DESCRIPTION P1.0 - P1.7. General purpose I/O Port 1 RST - Active high reset input. A logic 1 applied to this pin will activate a reset state. 17 This pin is pulled down internally so this pin can be left unconnected if not used. An RC power-on reset circuit is not needed and is not recommended. P3.0 RXD. General purpose I/O port pin 3.0. Also serves as the receive signal for the 19 on board UART.
PAGE 4
DS2250(T) INSTRUCTION SET The DS2250(T) executes an instruction set which is object code-compatible with the industry standard 8051 microcontroller. As a result, software development packages which have been written for the 8051 are compatible with the DS2250(T), including cross-assemblers, high-level language compilers, and debugging tools. Note that the DS2250(T) is functionally identical to the DS5000(T) except for package and the 64k memory option.
PAGE 5
DS2250(T) PROGRAM LOADING The Program Load Modes allow initialization of the NV RAM Program/Data Memory. This initialization may be performed in one of two ways: 1. Serial Program Loading which is capable of performing Bootstrap Loading of the DS2250(T). This feature allows the loading of the application program to be delayed until the DS2250(T) is installed in the end system. 2.
PAGE 6
DS2250(T) SERIAL BOOTSTRAP LOADER The Serial Program Load Mode is the easiest, fastest, most reliable, and most complete method of initially loading application software into the DS2250(T) nonvolatile RAM. Communication can be performed over a standard asynchronous serial communications port. A typical application would use a simple RS232C serial interface to program the DS2250(T) as a final production procedure.
PAGE 7
DS2250(T) The Parallel Program cycle is used to load a byte of data into a register or memory location within the DS2250(T). The Verify cycle is used to read this byte back for comparison with the originally loaded value to verify proper loading. The Security Set cycle may be used to enable and the software security feature. One may also enter bytes for the MCON register or for the five encryption registers using the Program MCON cycle.
PAGE 8
DS2250(T) ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………………..-0.3V to +7.0V Operating Temperature Range………………………………………………………………...0°C to +70°C Storage Temperature………………………………………………………………………...-40°C to +70°C Soldering Temperature………………………………………………………………+260°C for 10 seconds This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied.
PAGE 9
DS2250(T) AC CHARACTERISTICS—EXPANDED BUS MODE TIMING SPECIFICATIONS (VCC = 5V ±5%, TA = 0°C to +70°C.) # PARAMETER SYMBOL MIN MAX UNITS 1 Oscillator Frequency 1/tCLK 1.0 16 (-16) MHz 2 ALE Pulse Width tALPW 2tCLK -40 ns 3 Address Valid to ALE Low tAVALL tCLK -40 ns 4 Address Hold After ALE Low tAVAAV tCLK -35 ns 5 ALE Low to Valid Instr. In 6 ALE Low to PSEN Low tALLPSL tCLK -25 ns 7 PSEN Pulse Width tPSPW 3tCLK -35 ns 8 PSEN Low to Valid Instr.
PAGE 10
DS2250(T) EXPANDED PROGRAM MEMORY READ CYCLE EXPANDED DATA MEMORY READ CYCLE 10 of 18
PAGE 11
DS2250(T) EXPANDED DATA MEMORY WRITE CYCLE EXTERNAL CLOCK TIMING 11 of 18
PAGE 12
DS2250(T) AC CHARACTERISTICS—EXTERNAL CLOCK DRIVE (VCC = 5V ±5%, TA = 0°C to +70°C.) # PARAMETER SYMBOL MIN 28 External Clock High Time 29 MAX UNITS @ 12 MHz @ 16 MHz tCLKHPW 20 15 ns ns External Clock Low Time @ 12 MHz @ 16 MHz tCLKLPW 20 15 ns ns 30 External Clock Rise Time @ 12 MHz @ 16 MHz tCLKR 20 15 ns ns 31 External Clock Fall Time @ 12 MHz @ 16 MHz tCLKF 20 15 ns ns MAX UNITS AC CHARACTERISTICS—SERIAL PORT TIMING: MODE 0 (VCC = 5V ±5%, TA = 0°C to +70°C.
PAGE 13
DS2250(T) AC CHARACTERISTICS—POWER CYCLING TIMING (VCC = 5V ±5%, TA = 0°C to +70°C.) # PARAMETER SYMBOL MIN tF 40 32 Slew Rate from VCCmin to 3.
PAGE 14
DS2250(T) AC CHARACTERISTICS—PARALLEL PROGRAM LOAD TIMING (VCC = 5V ±5%, TA = 0°C to +70°C.) # PARAMETER SYMBOL MIN MAX UNITS 40 Oscillator Frequency 1/tCLK 1.0 12.0 MHz 41 Address Setup to PROG Low tAVPRL 0 42 Address Hold after PROG High tPRHAV 0 43 Data Setup to PROG Low tDVPRL 0 44 Data Hold after PROG High tPRHDV 0 45 P2.7, 2.6, 2.
PAGE 15
DS2250(T) PARALLEL PROGRAM LOAD TIMING CAPACITANCE (Test Frequency = 1MHz, TA = +25°C.
PAGE 16
DS2250(T) DS2250(T) TYPICAL ICC VS. FREQUENCY FREQUENCY OF OPERATION (MHz) (VCC = +5V, TA =+25°C) NORMAL OPERATION IS MEASURED USING: 1) EXTERNAL CRYSTALS ON XTAL1 AND 2. 2) ALL PORT PINS DISCONNECTED. 3) RST = 0V AND EA = VCC. 4) PART PERFORMING ENDLESS LOOP WRITING TO INTERNAL MEMORY. IDLE MODE OPERATION IS MEASURED USING: 1) EXTERNAL CLOCK SOURCE AT XTAL1; XTAL2 FLOATING. 2) ALL PORT PINS DISCONNECTED. 3) RST = 0V AND EA = VCC. 4) PART SET IN IDLE MODE BY SOFTWARE. NOTES: 1.
PAGE 17
DS2250(T) PACKAGE DRAWING PKG INCHES DIM MIN MAX A 2.645 2.655 B 2.379 2.389 C 0.845 0.855 D 0.395 0.405 E 0.245 0.255 F 0.050 BSC G 0.075 0.085 H 0.245 0.255 I 0.950 BSC J 0.120 0.130 K 1.320 1.330 L 1.445 1.455 M 0.057 0.067 N - 0.160 O - 0.195 P 0.047 0.
PAGE 18
DS2250(T) DATA SHEET REVISION SUMMARY The following represent the key differences between 12/13/95 and 08/16/96 version of the DS2250(T) data sheet. Please review this summary carefully. 1. Correct Figure 3 to show RST active high. 2. Add minimum value to PCB thickness. The following represent the key differences between 11/20/99 and 06/09/06 version of the DS2250(T) data sheet. Please review this summary carefully. 1. 2. 3. 4.