Datasheet

_________________________________________________________ Maxim Integrated Products 1
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DS34S101, DS34S102, DS34S104, DS34S108
Single/Dual/Quad/Octal TDM-over-Packet Chip
General Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC
compliant devices allow up to eight E1, T1 or serial
streams or one high-speed E3, T3, STS-1 or serial
stream to be transported transparently over IP, MPLS
or Ethernet networks. Jitter and wander of recovered
clocks conform to G.823/G.824, G.8261, and TDM
specifications. TDM data is transported in up to 64
individually configurable bundles. All standards-
based TDM-over-packet mapping methods are
supported except AAL2. Frame-based serial HDLC
data flows are also supported. The high level of
integration available with the DS34S10x devices
minimizes cost, board space, and time to market.
Applications
TDM Circuit Extension Over PSN
o Leased-Line Services Over PSN
o TDM Over GPON/EPON
o TDM Over Cable
o TDM Over Wireless
Cellular Backhaul Over PSN
Multiservice Over Unified PSN
HDLC-Based Traffic Transport Over PSN
Functional Diagram
Features
Transport of E1, T1, E3, T3 or STS-1 TDM or
Other CBR Signals Over Packet Networks
Full Support for These Mapping Methods:
SAToP, CESoPSN, TDMoIP (AAL1), HDLC,
Unstructured, Structured, Structured with CAS
Adaptive Clock Recovery, Common Clock,
External Clock and Loopback Timing Modes
On-Chip TDM Clock Recovery Machines, One
Per Port, Independently Configurable
Clock Recovery Algorithm Handles Network
PDV, Packet Loss, Constant Delay Changes,
Frequency Changes and Other Impairments
64 Independent Bundles/Connections
Multiprotocol Encapsulation Supports IPv4,
IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
VLAN Support According to 802.1p and 802.1Q
10/100 Ethernet MAC Supports MII/RMII/SSMII
Selectable 32-Bit, 16-Bit or SPI Processor Bus
Operates from Only Two Clock Signals, One for
Clock Recovery and One for Packet Processing
Glueless SDRAM Buffer Management
Low-Power 1.8V Core, 3.3V I/O
See detailed feature list in Section 7.
Ordering Information
PART PORTS TEMP RANGE PIN-PACKAGE
DS34S101GN
1
-40°C to +85°C
256 TECSBGA
DS34S101GN+
1
-40°C to +85°C
256 TECSBGA
DS34S102GN
2
-40°C to +85°C
256 TECSBGA
DS34S102GN+
2
-40°C to +85°C
256 TECSBGA
DS34S104GN
4
-40°C to +85°C
256 TECSBGA
DS34S104GN+
4
-40°C to +85°C
256 TECSBGA
DS34S108GN
8
-40°C to +85°C
484 HSBGA
DS34S108GN+
8
-40°C to +85°C
484 HSBGA
+Denotes a lead(Pb)-free/RoHS-compliant package (explanation).
CPU
Bus
Clock Inputs
xMII
Interface
Buffer
Manager
Circuit
Emulation
Engine
Clock
Adapters
10/100
Ethernet
MAC
TDM
Interfaces
SDRAM
Interface
DS34S108
Rev: 032609

Summary of content (198 pages)