Datasheet

+Denotes lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
*Future Product—Contact factory for availability.
PART BITS
SPEED
(ksps)
FULLY
DIFFERENTIAL
INPUT (MAX) (V)
REFERENCE
BUFFERS
PACKAGE
MAX11900* 16 1000 ±3.6 Internal/External 4mm x 4mm TQFN-20
MAX11901 16 1600 ±3.6 Internal/External 4mm x 4mm TQFN-20
MAX11902* 18 1000 ±3.6 Internal/External 4mm x 4mm TQFN-20
MAX11903 18 1600 ±3.6 Internal/External 4mm x 4mm TQFN-20
MAX11904* 20 1000 ±3.6 Internal/External 4mm x 4mm TQFN-20
MAX11905 20 1600 ±3.6 Internal/External 4mm x 4mm TQFN-20
PART TEMP RANGE PIN-PACKAGE
MAX11901ETP+ -40°C to +85°C 20 TQFN-EP*
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TQFN-EP T2044+5 21-0139 90-0429
www.maximintegrated.com
Maxim Integrated │ 28
MAX11901 16-Bit, 1.6Msps, Low-Power,
Fully Differential SAR ADC
Selector Guide
Chip Information
PROCESS: CMOS
Ordering Information
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.