Datasheet

MAX13253 1A, Spread-Spectrum, Push-Pull, Transformer
Driver for Isolated Power Supplies
www.maximintegrated.com
Maxim Integrated │ 2
Electrical Characteristics
(V
DD
= +3.0V to +5.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
DD
= +5.0V and T
A
= +25ºC.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
(All voltages referenced to GND.)
V
DD
, FAULT, CLK, HICLK, SPRD, EN....................-0.3V to +6V
T1, T2
.................................................................-0.3V to +16.5V
T1, T2 Maximum Continuous Current
..............................+1.75A
FAULT Maximum Continuous Current
.............................+50mA
Continuous Power Dissipation (T
A
= +70ºC)
TDFN (Multilayer Board)
(derate 24.4mW/ºC above +70ºC)
..........................1951.2mW
TDFN (Single-Layer Board)
(derate 18.5mW/ºC above +70ºC)
..........................1481.5mW
Operating Temperature Range
.......................... -40ºC to +125ºC
Junction Temperature
...................................................... +150ºC
Storage Temperature Range
.............................-65ºC to +150°C
Lead Temperature (soldering, 10s)
.................................+300°C
Soldering Temperature (reflow)
....................................... +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TDFN (Multilayer)
Junction-to-AmbientThermalResistance(θ
JA
) ..........41°C/W
 Junction-to-CaseThermalResistance(θ
JC
) .................9°C/W
TDFN (Single Layer)
Junction-to-AmbientThermalResistance(θ
JA
) ..........54°C/W
 Junction-to-CaseThermalResistance(θ
JC
) .................9°C/W
Absolute Maximum Ratings
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Supply Voltage Range V
DD
3.0 5.5 V
Supply Current I
DD
V
EN
= 0V, V
CLK
= 0V,
V
SPRD
= 0V, T1 and T2
not connected
V
HICLK
= 0V 1.1 1.8
mA
V
HICLK
= V
DD
2.1 3.5
Disable Supply Current I
DIS
V
EN
= V
DD
, T1, T2, CLK, SPRD, HICLK
connected to GND or V
DD
(Note 3)
5 µA
Driver Output Resistance R
O
I
OUT
= 500mA
V
DD
= 3.0V 160 350
mΩ
V
DD
= 4.5V 145 300
Undervoltage Lockout
Threshold
V
UVLO
V
DD
rising 2.6 2.75 2.9 V
Undervoltage Lockout
Threshold Hysteresis
V
UVLO_HYST
250 mV
T1, T2 Current Limit I
LIM
3.0V < V
DD
< 3.6V 1.1 1.3 1.5
A
4.5V < V
DD
< 5.5V 1.2 1.4 1.6
T1, T2 Leakage Current I
LKG
V
EN
= V
DD
, V
CLK
= 0V; T1, T2 = 0V or V
DD
-1 +1 µA