Datasheet

2 Maxim Integrated
High-ESD Profibus RS-485 Transceiver
MAX14770E
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
V
CC
....................................................................... -0.3V to +6.0V
RE, RO
.......................................................-0.3V to (V
CC
+ 0.3V)
DE, DI
...................................................................-0.3V to +6.0V
A, B
.....................................................................-8.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND
.................Continuous
Continuous Power Dissipation (T
A
= +70NC)
SO (derate 7.6mW/NC above +70NC)
.........................606mW
TDFN (derate 24.4mW/NC above +70NC)
.................1951mW
FMAX (derate 4.8mW/NC above +70NC)
.................. 387.8mW
Operating Temperature Range
MAX14470EESA...............................................-40NC to +85NC
MAX14470EG_A
............................................. -40NC to +105NC
MAX14470EATA
............................................. -40NC to +125NC
Storage Temperature Range
............................ -65NC to +150NC
Junction Temperature Range
........................... -40NC to +150NC
Lead Temperature (soldering, 10s)
................................+300NC
Soldering Temperature (reflow)
......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
CC
= +5V Q10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5V, T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SO
Junction-to-Ambient Thermal Resistance (q
JA
) ........ 132°C/W
Junction-to-Case Thermal Resistance (q
JC
)...............38°C/W
µMAX
Junction-to-Ambient Thermal Resistance (q
JA
) ..... 206.3°C/W
Junction-to-Case Thermal Resistance (q
JC
)...............42°C/W
TDFN
Junction-to-Ambient Thermal Resistance (q
JA
) .......... 41°C/W
Junction-to-Case Thermal Resistance (q
JC
).................8°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Power-Supply Range V
CC
4.5 5.5 V
Supply Current I
CC
DE = 1, RE = 0 or
DE = 0, RE = 0 or
DE = 1, RE = 1; no load
2.5 4 mA
Shutdown Supply
Current
I
SH
DE = 0, RE = 1
15
FA
DRIVER
Differential Driver
Output
|V
OD
|
R
L
= 54I, DI = V
CC
or GND; Figure 1
2.1 V
Differential Driver
Peak-to-Peak Output
V
ODPP
Figure 2 (Note 3) 4.0 6.8 V
Change in Magnitude
of Differential Output
Voltage
DV
OD
R
L
= 54I; Figure 1 (Note 4)
-0.2 0 +0.2 V
Driver Common-
Mode Output Voltage
V
OC
R
L
= 54I; Figure 1
1.8 3 V
Change in Common-
Mode Voltage
DV
OC
R
L
= 54I; Figure 1 (Note 4)
-0.2 +0.2 V
Driver Short-Circuit
Output Current
(Note 5)
I
OSD
0V P V
OUT
P +12V; output low
+250
mA
-7V P V
OUT
P V
CC
; output high
-250