Datasheet
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
10 µMAX U10+2 21-0061
90-0330
16 QSOP E16+1 21-0055 90-0167
QSOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
POL SYNC
IN
EXT
CS
PGND
GND
GND
N.C.
MAX1847
VL
FREQ
FB
COMP
REF
N.C.
1
++
2
3
4
5
10
9
8
7
6
IN
EXT
CS
PGNDREF
COMP
FREQ
VL
MAX1846
µMAX
TOP VIEW
GNDFB
SHDN
www.maximintegrated.com
Maxim Integrated
│
19
MAX1846–MAX1847 High-Efciency, Current-Mode,
Inverting PWM Controller
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
Pin Congurations