Datasheet

MAX3202E/MAX3203E/MAX3204E/MAX3206E
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= +5V ±5%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5V and T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: Limits over temperature are guaranteed by design, not production tested.
Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the
Applications Information section for more information.
Note 4: Guaranteed by design. Not production tested.
V
CC
to GND...........................................................-0.3V to +7.0V
I/O_ to GND................................................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
2 × 2 WLP (derate 11.5mW/°C above +70°C)...............920mW
3 × 2 WLP (derate 12.3mW/°C above +70°C)...............984mW
3 × 3 WLP (derate 14.1mW/°C above +70°C).............1128mW
6-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
12-Pin TQFN (derate 16.9mW/°C above +70°C) ........1349mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
0.9 5.5 V
Supply Current I
CC
1 100 nA
Diode Forward Voltage V
F
I
F
= 10mA 0.65 0.95 V
Positive transients V
CC
+ 25
T
A
= +25°C, ±15kV
Human Body Model,
I
F
= 10A
Negative transients -25
Positive transients V
CC
+ 60
T
A
= +25°C, ±8kV
Contact Discharge
(IEC 61000-4-2), I
F
= 24A
Negative transients -60
Positive transients V
CC
+ 100
Channel Clamp Voltage
(Note 3)
V
C
T
A
= +25°C, ±15kV
Air-Gap Discharge
(IEC 61000-4-2), I
F
= 45A
Negative transients -100
V
Channel Leakage Current T
A
= 0°C to +50°C (Note 4) -1 +1 nA
Channel Input Capacitance V
CC
= 5V, bias of V
CC
/2 5 7 pF
ESD PROTECTION
Human Body Model ±15 kV
IEC 61000-4-2
Contact Discharge
±8 kV
IEC 61000-4-2
Air-Gap Discharge
±15 kV
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
4 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............87°C/W
6 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............84°C/W
9 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............71°C/W
6 TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
)....................42°C/W
Junction-to-Case Thermal Resistance (θ
JC
)...........................9°C/W
12 TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)....................41°C/W
Junction-to-Case Thermal Resistance (θ
JC
)...........................6°C/W