Datasheet

MAX3370/MAX3371
1µA, 2Mbps, Low-Voltage Level
Translators in SC70 and µDFN
_______________________________________________________________________________________ 9
Speed-Up
The speed-up circuit is a one-shot generator that helps
the rise time of the output waveform in the low-to-high
transition. When triggered, switches S
1
and S
2
turn on
for 320ns to pull up I/O V
L
and I/O V
CC
. This greatly
reduces the rise time and propagation delay for the
low-to-high transition as well as improves the duty cycle
(closer to 50% for an ideal square-wave input). See the
scope plots in the
Typical Operating Characteristics for
the speed-up circuitry in operation.
Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of transmitting incor-
rect data, decouple V
CC
and V
L
to ground with a 0.1µF
capacitor as close to the device as possible.
I
2
C Level Translation
The MAX3370/MAX3371 are ideal for level translation
between a low-voltage ASIC and an I
2
C device. The
devices’ bidirectional natures allow their use in the data
line of I
2
C communications. A typical application is
interfacing a low-voltage microprocessor to a 3V or 5V
D/A converter, such as the MAX517.
The I/O lines on the MAX3370/MAX3371 are bidirec-
tional, can be level-shifted up to +5.5V, and contain
internal 10kΩ pullup resistors to allow open-drain dri-
ving (see the
Typical Operating Circuit ).
Push-Pull vs. Open-Drain Driving
The MAX3370/MAX3371 I/O pins can be driven by a
push-pull or open-drain device. When using a push-pull
driver, the MAX3370/MAX3371 operate up to 2Mbps
with a 10pF load or 1Mbps with a 50pF load. The inter-
nal pullup resistors on the I/O pins allow use with open-
drain devices. The MAX3370/MAX3371 operate up to
500kbps with a 30pF load when driven by an open-
drain device.
Data rates higher than those listed in the Electrical
Characteristics table can be achieved. The maximum
data rate is limited to 3Mbps by the speed-up circuitry.
Unidirectional vs. Bidirectional Level Translator
The MAX3370/MAX3371 may also be used to translate
unidirectional signals without signal inversion. The
devices provide the smallest solution (SC70 package)
for unidirectional level translation without inversion.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
5 SC70 X5+1
21-0076
6 SC70 X6SN+1
21-0077
6 µDFN L611+2
21-0147