Datasheet

Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of transmitting incor-
rect data, bypass V
L
and V
CC
to ground with a 0.1µF
capacitor. See the Typical Operating Circuit. To ensure
full ±15kV ESD protection, bypass V
CC
to ground with a
1µF capacitor. Place all capacitors as close to the
power-supply inputs as possible.
I
2
C Level Translation
The MAX3373E–MAX3376E, MAX3378E/MAX3379E
and MAX3390E–MAX3393E level-shift the data present
on the I/O lines between +1.2V and +5.5V, making
them ideal for level translation between a low-voltage
ASIC and an I
2
C device. A typical application involves
interfacing a low-voltage microprocessor to a 3V or 5V
D/A converter, such as the MAX517.
Push-Pull vs. Open-Drain Driving
All devices in the MAX3372E–MAX3379E and
MAX3390E–MAX3393E family may be driven in a push-
pull configuration. The MAX3373E–MAX3376E/
MAX3378E/MAX3379E and MAX3390E–MAX3393E
include internal 10kΩ resistors that pull up I/O V
L_
and
I/O V
CC_
to their respective power supplies, allowing
operation of the I/O lines with open-drain devices. See
the Timing Characteristics table for maximum data rates
when using open-drain drivers.
MAX3372E–MAX3379E/MAX3390E–MAX3393E
±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad
Low-Voltage Level Translators in UCSP
14
Maxim Integrated
t
r
= 0.7ns to 1ns
30ns
60ns
t
100%
90%
10%
I
PEAK
I
Figure 4b. IEC 1000-4-2 ESD Generator Current Waveform
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
C
s
150pF
R
C
50MΩ to 100MΩ R
D
330Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE-
UNDER-
TEST
Figure 4a. IEC 1000-4-2 ESD Test Model
MAX3378E–MAX3383E
THREE-STATE
I/O V
L_
DATA
DATA
I/O V
CC_
0.1µF0.1µF
1µF
+3.3V+1.8V
V
CC
+3.3V
SYSTEM
+1.8V
SYSTEM
CONTROLLER
V
L
Typical Operating Circuit