Datasheet

ManualsBrandsMAXIM INTEGRATED ManualsLogic ICsLogic IC - Transducer Converter, Bidirectional, Three-state TQFN 12 (4x4)

General Description

The MAX3394E/MAX3395E/MAX3396E bidirectional

level translators provide level shifting required for data

transfer in a multivoltage system. Internal slew-rate

enhancement circuitry features 10mA current-sink and

15mA current-source drivers to isolate capacitive loads

from lower current drivers. In open-drain systems, slew-

rate enhancement enables fast data rates with larger

pullup resistors and increased bus load capacitance.

Externally applied voltages, V

and V

, set the logic-

high levels for the device. A logic-low signal on one I/O

side of the device appears as a logic-low signal on the

opposite I/O side, and vice-versa. Each I/O line is

pulled up to V

or V

by an internal pullup resistor,

allowing the devices to be driven by either push-pull or

open-drain drivers.

The MAX3394E/MAX3395E/MAX3396E feature a tri-

state output mode, thermal-shutdown protection, and

±15kV Human Body Model (HBM) ESD protection on

the V

side for greater protection in applications that

route signals externally.

The MAX3394E/MAX3395E/MAX3396E accept V

volt-

ages from +1.65V to +5.5V, and V

voltages from +1.2V

to V

, making them ideal for data transfer between low

voltage ASIC/PLDs and higher voltage systems. The

MAX3394E/MAX3395E/MAX3396E operate at a guaran-

teed data rate of 6Mbps with push-pull drivers and

1Mbps with open-drain drivers.

The MAX3394E is a dual-level translator available in

9-bump UCSP™ and 8-pin 3mm x 3mm TDFN packages.

The MAX3395E is a quad-level translator available in 12-

bump UCSP, and 12-pin 4mm x 4mm TQFN packages.

The MAX3396E is an octal-level translator available in 20-

bump UCSP and 20-pin 5mm x 5mm TQFN packages.

The MAX3394E/MAX3395E/MAX3396E operate over the

extended -40°C to +85°C temperature range.

Applications

Multivoltage Bidirectional Level Translation

SPI™, MICROWIRE™, and I

C Level Translation

Open-Drain Rise-Time Speed-Up

High-Speed Bus Fan-Out Expansion

Cell Phones

Telecom, Networking, Servers, RAID/SAN

Features

♦ ±15kV ESD Protection on I/O V

CC_

Lines

♦ Bidirectional Level Translation Without Direction

♦ I/O V

and I/O V

CC_

10mA Sink-/15mA Source-

Current Capability

♦ Slew-Rate Enhancement Circuitry Supports

Larger Capacitive Loads or Larger External Pullup

Resistors

♦ 6Mbps Push-Pull/1Mbps Open-Drain Guaranteed

Data Rate

♦ Wide Supply-Voltage Range: Operation Down to

+1.2V on V

and +1.65V on V

♦ Low Supply Current in Tri-State Output Mode

(3µA typ)

♦ Low Quiescent Current

♦ Thermal-Shutdown Protection

♦ UCSP, TDFN, and TQFN Packages

MAX3394E/MAX3395E/MAX3396E

±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/

Octal-Level Translators with Speed-Up Circuitry

________________________________________________________________

Maxim Integrated Products

19-3884; Rev 2; 2/07

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

I/O V

GND

*CONNECT EXPOSED PAD TO GROUND

*EP

I/O V

MAX3394E

TDFN

TOP VIEW

(LEADS ON BOTTOM)

Pin Configurations

Ordering Information

PART PIN-PACKAGE PKG CODE

MAX3394EETA+T 8 TDFN-EP** T833-1

MAX3394EEBL+T 9 UCSP B9-5

MAX3395EETC+ 12 TQFN-EP** T1244-4

MAX3395EEBC+T 12 UCSP B12-1

MAX3396EEBP+T* 20 UCSP B20-1

MAX3396EETP+* 20 TQFN-EP** T2055-4

MICROWIRE is a trademark of National Semiconductor Corp.

SPI is a trademark of Motorola, Inc.

UCSP is a trademark of Maxim Integrated Products, Inc.

Note: All devices specified over the -40°C to +85°C operating

range.

Denotes lead(Pb)-free/RoHS-compliant package.

Future product—contact factory for availability.

**EP = Exposed paddle.

Pin Configurations continued at end of data sheet.

Selector Guide appears at end of data sheet.

Summary of content (20 pages)

PAGE 1
9-3884; Rev 2; 2/07 ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry Features ♦ ±15kV ESD Protection on I/O VCC_ Lines ♦ Bidirectional Level Translation Without Direction Pin ♦ I/O VL_ and I/O VCC_ 10mA Sink-/15mA SourceCurrent Capability ♦ Slew-Rate Enhancement Circuitry Supports Larger Capacitive Loads or Larger External Pullup Resistors ♦ 6Mbps Push-Pull/1Mbps Open-Drain Guaranteed Data Rate ♦ Wide Supply-Voltage Range: Operation Down to +1.
PAGE 2
MAX3394E/MAX3395E/MAX3396E ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry ABSOLUTE MAXIMUM RATINGS (All voltages referenced to GND.) VCC ......................................................................... -0.3V to +6V VL ............................................................................ -0.3V to +6V I/O VCC_ ...................................................... -0.3V to VCC + 0.3V I/O VL_ ...............................................
PAGE 3
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry (VCC = +1.65V to +5.5V, VL = +1.2V to VCC; CIOVL ≤ 15pF, CIOVCC ≤ 15pF; TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL I/O VL_ Low-to-High Transition Threshold VL-TH I/O VL_ Output-Voltage Low VOLL CONDITIONS VCC = +3.3V, VL = +1.8V MIN TYP 0.3 x VL 0.
PAGE 4
MAX3394E/MAX3395E/MAX3396E ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry TIMING CHARACTERISTICS (VCC = +1.65V to +5.5V, VL = +1.2V to VCC; CIOVL ≤ 15pF, CIOVCC ≤ 15pF; TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.
PAGE 5
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry 1.0 0.5 1.5 6Mbps PUSH-PULL 1.0 3.0 3.5 4.0 4.5 5.0 2.0 2.5 3.0 3.5 4.0 VCC SUPPLY VOLTAGE (V) VL SUPPLY VOLTAGE (V) VL SUPPLY CURRENT vs. TEMPERATURE VCC SUPPLY CURRENT vs. LOAD CAPACITANCE 0.30 6Mbps PUSH-PULL 0.25 0.20 1Mbps OPEN-DRAIN 0.15 0.10 4.5 3.0 DRIVING I/O VL_ 2.5 2.0 1.5 6Mbps PUSH-PULL 1.0 -15 10 35 0.7 0.6 0.5 0.4 0.3 1Mbps OPEN-DRAIN 0.
PAGE 6
Typical Operating Characteristics (continued) (VCC = +2.5V, VL = +1.8V, CL = 15pF, TA = +25°C, unless otherwise noted.) 8 6 4 DRIVING I/O VL_ 25 tPDHL 20 15 10 2 5 0 0 10 8 6 tPDHL tPDLH 2 10 20 30 40 50 60 70 80 90 100 0 PROPAGATION DELAY vs. LOAD CAPACITANCE PROPAGATION DELAY vs. LOAD CAPACITANCE (DRIVING I/O VL_, VCC = +2.5V, VL = +1.
PAGE 7
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry PIN MAX3394E TDFN 1 UCSP A1 MAX3395E TQFN 11 UCSP B1 MAX3396E TQFN 14 4 NAME FUNCTION VCC VCC Supply Voltage +1.65V ≤ VCC ≤ +5.5V. Bypass VCC to GND with a 0.1µF ceramic capacitor and a 1µF or greater ceramic capacitor as close to the device as possible. EN Enable Input. Drive EN logic high for normal operation.
PAGE 8
MAX3394E/MAX3395E/MAX3396E ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry VL tRVCC VCC VL 90% VCC EN VL MAX3394E MAX3395E MAX3396E tFVCC 90% I/O VL 50% VCC 50% 50% 50% I/O VL_ I/O VCC_ I/O VCC 50Ω 10% 10% CIOVCC tI/OVL-VCC tI/OVL-VCC Figure 1.
PAGE 9
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry VL EN I/O VCC VCC MAX3394E MAX3395E MAX3396E VL tFVL tRVL VCC MAX3394E/MAX3395E/MAX3396E VL VCC 90% 50% 90% 50% 50% 50% I/O VCC_ I/O VL_ 50Ω 10% 10% I/O VL CIOVL tI/OVCC-VL tI/OVCC-VL Figure 3.
PAGE 10
MAX3394E/MAX3395E/MAX3396E ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry VL VCC VL VCC VCC VL VCC EN EN VL VL MAX3394E MAX3395E MAX3396E VCC RLOAD RLOAD I/O VL_ I/O VCC_ I/O VL_ VL CIOVCC MAX3394E MAX3395E MAX3396E VCC I/O VCC_ CIOVL 50Ω 50Ω tEN V I/O VCC_ EN 0.5V TIME V tEN EN I/O VL_ 0.2V (VL < 2V) 0.5V (VL ≥ 2V) TIME Figure 5.
PAGE 11
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE Cs 100pF RD 1500Ω IP 100% 90% DISCHARGE RESISTANCE STORAGE CAPACITOR Ir PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) AMPERES DEVICEUNDERTEST 36.8% 10% 0 0 tRL TIME tDL CURRENT WAVEFORM Figure 6a. Human Body ESD Test Model Figure 6b.
PAGE 12
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry MAX3394E/MAX3395E/MAX3396E Functional Diagram VCC VL VL MP1 VCC MP2 GATE CONTROL I/O VL_ I/O VCC_ N-CHANNEL PASS-FET SLEW-RATE ENHANCEMENT MN3 MN4 Typical Operating Circuit +1.8V +3.3V 0.1μF +1.8V SYSTEM CONTROLLER EN CLK DATA GND VL 1μF +3.3V SYSTEM MAX3394E EN I/O VL1 I/O VL2 I/O VCC1 CLK I/O VCC2 DATA GND itance with a characteristic RC charging waveform.
PAGE 13
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry TOP VIEW (BUMPS ON BOTTOM) 1 2 3 VCC I/O VCC1 I/O VCC2 A B MAX3394E EN GND C VL I/O VL1 I/O VL2 I/O VCC3 I/O VCC4 TOP VIEW (LEADS ON BOTTOM) I/O VCC2 UCSP 9 8 7 TOP VIEW (BUMPS ON BOTTOM) 1 2 3 4 MAX3395E A I/O VCC1 10 VCC 11 VL 12 *EP MAX3395E 6 EN 5 GND 4 I/O VL4 I/O VL1 I/O VL2 I/O VL3 I/O VL4 VCC VL EN GND I/O VCC1 I/O VCC2 I/O VCC3 I/O VCC4 B 1 2
PAGE 14
MAX3394E/MAX3395E/MAX3396E ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry Selector Guide NUMBER OF TRANSLATORS TOP MARK MAX3394EETA+T 2 APE MAX3394EEBL+T 2 AEZ MAX3395EETC+ 4 AAFZ MAX3395EEBC+T 4 ACO MAX3396EEBP+T 8 — MAX3396EETP+ 8 — PART Chip Information PROCESS: BiCMOS CONNECT EXPOSED PAD TO GND. Note: All devices specified over the -40°C to +85°C operating range. +Denotes lead(Pb)-free/RoHS-compliant package.
PAGE 15
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry COMMON DIMENSIONS PACKAGE VARIATIONS MIN. MAX. PKG. CODE N D2 E2 e JEDEC SPEC b A 0.70 0.80 T633-2 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF D 2.90 3.10 T833-2 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF E 2.90 3.10 T833-3 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF A1 0.00 0.05 T1033-1 10 1.50±0.
PAGE 16
Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 9LUCSP, 3x3.
PAGE 17
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry 12L, UCSP 4x3.EPS PACKAGE OUTLINE, 4x3 UCSP 21-0104 F 1 1 ______________________________________________________________________________________ 17 MAX3394E/MAX3395E/MAX3396E Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.
PAGE 18
Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 24L QFN THIN.
PAGE 19
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry QFN THIN.EPS ______________________________________________________________________________________ 19 MAX3394E/MAX3395E/MAX3396E Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.
PAGE 20
Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 5x4 UCSP.