Datasheet

General Description
The MAX4719 low-voltage, low on-resistance (R
ON
),
dual single-pole/double throw (SPDT) analog switch
operates from a single +1.8V to +5.5V supply. The
MAX4719 features 20 R
ON
(max) with 1.2 flatness
and 0.4 matching between channels. The switch offers
break-before-make switching (1ns) with t
ON
<80ns and
t
OFF
<40ns at +2.7V. The digital logic inputs are +1.8V
logic compatible with a +2.7V to +3.6V supply.
The switch is packaged in a chip-scale package
(UCSP™), significantly reducing the required PC board
area. The chip occupies only a 2.0mm 1.50mm area
and has a 4 3 bump array with a bump pitch of
0.5mm. The MAX4719 is also available in a 10-pin
µMAX package.
Applications
Cell Phones
Battery-Operated Equipment
Audio/Video-Signal Routing
Low-Voltage Data-Acquisition Systems
Sample-and-Hold Circuits
PDAs
Features
-3dB Bandwidth: >300MHz
Low 15pF On-Channel Capacitance
Single-Supply Operation from +1.8V to +5.5V
20 R
ON
(max) Switch
0.4 (max) R
ON
Match (+3.0V Supply)
1.2 (max) R
ON
Flatness (+3.0V Supply)
Rail-to-Rail
®
Signal Handling
High Off-Isolation: -55dB (10MHz)
Low Crosstalk: -80dB (10MHz)
Low Distortion: 0.03%
+1.8V CMOS-Logic Compatible
<0.5nA Leakage Current at +25°C
MAX4719
20
, 300MHz Bandwidth, Dual SPDT Analog
Switch in UCSP
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-2626; Rev 0; 10/02
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART TEMP RANGE
PIN/BUMP-
PACKAGE
TOP
MARK
MAX4719EUB -40°C to +85°C 10 µMAX
MAX4719EBC-T* -40°C to +85°C 12 UCSP-12 ABJ
COM2COM1
NO2NO1
NC2
IN2IN1
NC1
GND
V+
TOP VIEW
IN_
0
1
NO_
MAX4719
OFF
ON
NC_
ON
SWITCHES SHOWN FOR LOGIC "0" INPUT
OFF
UCSP
MAX4719
MAX4719
NC2
IN1
GND
NC1
2
3
9
8
COM2
IN2
COM1
NO1
1
10
NO2
V+
4
5
7
6
µMAX
C1
C2
C3
C4 B4 A4
A3
A2
A1B1
(BUMP SIDE
DOWN)
Pin Configurations/Functional Diagrams/Truth Table
UCSP is a trademark of Maxim Integrated Products, Inc.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
Note: UCSP package requires special solder temperature pro-
file described in the Absolute Maximum Ratings section.
*UCSP reliability is integrally linked to the user’s assembly meth-
ods, circuit board material, and environment. See the UCSP reli-
ability notice in the UCSP Reliability section of this data sheet for
more information.

Summary of content (11 pages)