Datasheet

MAX5048
7.6A, 12ns, SOT23/TDFN, MOSFET Driver
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V+ = +12V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltages Referenced to GND
V+ ...........................................................................-0.3V to +13V
IN+, IN-...................................................................-0.3V to +14V
N_OUT, P_OUT ............................................-0.3V to (V+ + 0.3V)
N_OUT Continuous Output Current (Note 1) ....................390mA
P_OUT Continuous Output Current (Note 1).....................100mA
Continuous Power Dissipation* (T
A
= +70°C)
6-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW
6-Pin TDFN (derate 18.2mW/°C above +70°C) .........1454mW
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: Continuous output current is limited by the power dissipation of the package.
*As per JEDEC51 standard.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
V+ Operating Range V+ 4.0 12.6 V
V+ Undervoltage Lockout UVLO V+ rising 3.25 3.6 4.00 V
V+ Undervoltage Lockout
Hysteresis
400 mV
V+ Undervoltage Lockout to
Output Delay Time
V+ rising 300 ns
V+ Supply Current I+ IN+ = IN- = V+ 0.95 1.5 mA
n-CHANNEL OUTPUT
T
A
= +25°C 0.23 0.32
V
V+
= +10V,
I
N-OUT
= -100mA
T
A
= +125°C 0.38 0.43
T
A
= +25°C 0.24 0.34
Driver Output Resistance—
Pulling Down (MAX5048AAUT/
MAX5048BAUT)
R
ON-N
V
V+
= +4.5V,
I
N-OUT
= -100mA
T
A
= +125°C 0.40 0.47
Ω
T
A
= +25°C 0.31 0.34
V
V+
= +10V,
I
N-OUT
= -100mA
T
A
= +125°C 0.46 0.51
T
A
= +25°C 0.32 0.36
Driver Output Resistance—
Pulling Down (MAX5048AATT/
MAX5048BATT)
R
ON-N
V
V+
= +4.5V,
I
N-OUT
= -100mA
T
A
= +125°C 0.48 0.55
Ω
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SOT23
Junction-to-Case Thermal Resistance (θ
JC
)......................75°C/W
TDFN
Junction-to-Case Thermal Resistance (θ
JC
).......................8.5°C/W