Datasheet

MAX5477/MAX5478/MAX5479
Dual, 256-Tap, Nonvolatile, I
2
C-Interface,
Digital Potentiometers
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
DD
= +2.7V to +5.25V, H_ = V
DD
, L_ = GND, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
DD
= +5V,
T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SDA, SCL, V
DD
to GND.........................................-0.3V to +6.0V
All Other Pins to GND.................................-0.3V to (V
DD
+ 0.3V)
Maximum Continuous Current into H_, L_, and W_
MAX5477......................................................................±5.0mA
MAX5478......................................................................±1.3mA
MAX5479......................................................................±0.6mA
Continuous Power Dissipation (T
A
= +70°C)
16-Pin TQFN (derate 17.5mW/°C above +70°C) .......1398mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ........57.2°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ................40°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ......100.4°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ................30°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC PERFORMANCE (VOLTAGE-DIVIDER MODE)
Resolution 256 Taps
Integral Nonlinearity INL (Note 3) ±1 LSB
Differential Nonlinearity DNL (Note 3) ±0.5 LSB
Dual Code Matching R0 and R1 set to same code (all codes) ±1 LSB
End-to-End Resistance
Temperature Coefficient
TC
R
70 ppm/°C
Ratiometric Resistance
Temperature Coefficient
10 ppm/°C
MAX5477 -4
MAX5478 -0.6
Full-Scale Error
MAX5479 -0.3
LSB
MAX5477 4
MAX5478 0.6
Zero-Scale Error
MAX5479 0.3
LSB
DC PERFORMANCE (VARIABLE-RESISTOR MODE)
V
DD
= 3V ±3
Integral Nonlinearity (Note 4) INL
V
DD
= 5V ±1.5
LSB
MAX5477 ±1
MAX5478 ±1
Differential Nonlinearity (Note 4) DNL
MAX5479 ±1
LSB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.