Datasheet

MAX5803/MAX5804/MAX5805
Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output
Voltage DACs with Internal Reference and I
2
C Interface
30Maxim Integrated
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character,
but the drawing pertains to the package regardless of RoHS
status.
Ordering Information
Note: All devices are specified over the -40°C to +125°C temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
PART PIN-PACKAGE RESOLUTION (BIT) INTERNAL REFERENCE TEMPCO (ppm/NC)
MAX5803ATB+T 10 TDFN-EP* 8 10 (typ), 25 (max)
MAX5803AUB+ 10 FMAX 8 10 (typ), 25 (max)
MAX5804ATB+T 10 TDFN-EP* 10 10 (typ), 25 (max)
MAX5804AUB+ 10 FMAX 10 10 (typ), 25 (max)
MAX5805AAUB+ 10 FMAX 12 4 (typ), 12 (max)
MAX5805BATB+T 10 TDFN-EP* 12 10 (typ), 25 (max)
MAX5805BAUB+ 10 FMAX 12 10 (typ), 25 (max)
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
10 TDFN-EP T1032N+1
21-0429 90-0082
10 FMAX
U10+2
21-0061 90-0330