Datasheet

2 Maxim Integrated
1V to 16V, Single-Channel, Hot-Swap Controllers
with Precision Current-Sensing Output
MAX5977A/MAX5977B
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PWR, SENSE, IN, FCOMP, SCOMP,
GATE, SOURCE, CALSENSE to GND ...............-0.3V to +28V
PG, CAL, BIAS, UV, OV, FAULT, CSOUT to GND .. -0.3V to +6V
REG to GND ............................................................-0.3V to +4V
GATE to SOURCE ...................................................-0.3V to +6V
IN to FCOMP, IN to SCOMP, IN to SENSE,
IN to CALSENSE ..................................................-0.3V to +1V
GND to AGND ......................................................-0.3V to +0.3V
FAULT, PG Current ........................................... -1mA to +50mA
GATE, SOURCE, GND Current ........................................750mA
Input/Output Current (all other pins) ..................................20mA
Continuous Power Dissipation (T
A
= +70NC)
20-Pin TQFN, Single-Layer Board
(derate 16.9mW/NC above +70NC)..........................1355.9mW
20-Pin TQFN, Multilayer Board
(derate 25.6mW/NC above +70NC)..........................2051.3mW
Junction-to-Ambient Thermal Resistance (Note 1)
B
JA
, Single-Layer Board ........................................... +59NC/W
B
JA
, Multilayer Board ................................................ +39NC/W
Junction-to-Case Thermal Resistance (Note 1)
B
JC
, Single-Layer and Multilayer Board...................... +6NC/W
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
PWR
= V
IN
= 12V, R
SENSE
= 4mI, R
FCOMP
= R
SCOMP
= 2kI, R
GATE
= 1kI, C
GATE
= 330nF, C
REG
= 1FF, unless otherwise noted.
Typical Values at V
PWR
= V
IN
= 3.3V, T
A
= +25NC, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range V
PWR
2.7 3.3 16 V
Undervoltage Lockout V
UVLO
Minimum rising voltage on PWR 2.69 V
Undervoltage-Lockout Hysteresis V
UVLOHYS
100 mV
Supply Current I
PWR
0.734 4 mA
Internal LDO Output Voltage V
REG
2.7V < V
PWR
< 16V, 0 to 1mA 2.49 2.6 V
CURRENT-MONITORING FUNCTION
IN Input Range Common-mode range 1 16 V
SCOMP Input Range 1 16 V
FCOMP Input Range 1 16 V
IN Input Current 135
FA
SENSE Input Current V
IN
= V
SENSE
= 1V to 16V 6
FA
Circuit-Breaker Current (Slow
Comparator)
I
SCOMP
V
SCOMP
= 1V to 16V 24.0 25 26.0
FA
Circuit-Breaker Current (Fast
Comparator)
I
FCOMP
V
FCOMP
= 1V to 16V 48.1 50 51.4
FA
Slow Current-Limit Threshold
Error
V
SENSE
- V
SCOMP
= 50mV -2.0 +2.1 mV
Fast Current-Limit Threshold Error V
SENSE
- V
FCOMP
= 100mV -2.2 +1.4 mV
Slow-Comparator Response Time t
SCD
1mV overdrive 1 ms
50mV overdrive 130
Fs
Fast-Comparator Response Time t
FSD
10mV overdrive, from overload condition,
V
PWR
= 12V
200 ns