Datasheet

MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
11
Maxim Integrated
INDEXTM and INDEXTD Inductors
Short INDEXTM and INDEXTD to ground using 0Ω
resistors. For applications requiring improved RF-to-IF
and LO-to-IF isolation, use 10nH inductors (L3 and L6)
in place of the 0Ω resistors. However, to ensure stable
operation, the mixer IF ports must be presented with
low common-mode load impedance. Contact the facto-
ry for details. Since approximately 100mA flows through
INDEXTM and INDEXTD, it is important to use low-DCR
wire-wound inductors.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground pin traces
directly to the exposed pad under the package. The
PCB exposed pad MUST be connected to the ground
plane of the PCB. It is suggested that multiple vias be
used to connect this pad to the lower-level ground
planes. This method provides a good RF/thermal-con-
duction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX9995 evaluation kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maximintegrated.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin with a
capacitor as close as possible to the pin ( Typical
Application Circuit ).
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX9995’s 36-pin TQFN-
EP package provides a low thermal-resistance path to
the die. It is important that the PCB on which the
MAX9995 is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a low-
inductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
36 TQFN-EP T3666+2
21-0141 90-0049
Chip Information
PROCESS: SiGe BiCMOS
Lead-Free/RoHS Considerations
http://www.maximintegrated.com/emmi/faq.cfm
Reliability Information:
http://www.maximintegrated.com/reliability/product/
MAX9995.pdf
Table 1. Component Values
COMPONENT VALUE DESCRIPTION
C1, C8 4pF Microwave capacitors (0402)
C2, C7 10pF Microwave capacitors (0402)
C3, C6 0.033µF Microwave capacitors (0603)
C4, C5, C14, C16 22pF Microwave capacitors (0402)
C9, C13, C15,
C17, C18
0.01µF Microwave capacitors (0402)
C10, C11, C12,
C19, C20, C21
150pF Microwave capacitors (0603)
L1, L2, L4, L5 330nH
Wire-wound high-Q inductors
(0805)
L3, L6 10nH
Wire-wound high-Q inductors
(0603)
R1, R4 1.21kΩ±1% resistors (0402)
R2, R5 392Ω±1% resistors (0402)
R3, R6 10Ω±1% resistors (1206)
T1, T2
4:1
(200:50)
IF baluns
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.