Datasheet

MAXQ610
16-Bit Microcontroller with Infrared Module
28 ______________________________________________________________________________________
P0.1/RX0
R3.1/INT9
P0.2/TX0
P0.3/RX1
P0.4/TX1
P0.5/TBA0/TBA1
P0.6/TBB0 P0.7/TBB1
P1.0/INT0 P3.0/INT8
P0.0/IRTXM
1 2 3 4 5 6 7 8 9
10 11
P3.6/INT14
P3.7/INT15
P2.6/TMS
P2.7/TDO
V
DD
GND
IRTX
IRRX
P2.5/TDI
P2.4/TCK
34
35
36
37
38
39
40
41
42
43
44
GND
V
DD
REGOUT
GND
P3.3/INT11
P3.2/INT10
P1.3/INT3
P1.2/INT2
P1.1/INT1
P1.4/INT4
P1.5/INT5
22
21
20
19
18
17
16
15
14
13
12
P3.5/INT13 P3.4/INT12 P2.1/MISO GND P2.0/MOSI P1.7/INT7 P1.6/INT6 HFXOUT HFXIN P2.2.SCLK P2.3/SSEL
33 32 31 30 29 28 27 26 25 24 23
TQFN
TOP VIEW
*EXPOSED PAD = GND.
MAXQ610
+
*EP
RESET
Pin Configurations (continued)
Package Information
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains
to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.
32 TQFN-EP T3255+3
21-0140 90-0001
40 TQFN-EP T4066+2
21-0141 90-0053
44 TQFN-EP T4477+2
21-0144 90-0127