Datasheet

Copyright © 2009 Future Technology Devices International Limited 37
Document No.: FT_000053
FT232R USB UART IC Datasheet Version 2.02
Clearance No.: FTDI# 38
9.5 Solder Reflow Profile
The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
Figure 9.5 FT232R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT232R is used with non-Pb free solder).
Profile Feature Pb Free Solder Process Non-Pb Free Solder Process
Average Ramp Up Rate (T
s
to T
p
) 3°C / second Max. 3°C / Second Max.
Preheat
- Temperature Min (T
s
Min.)
- Temperature Max (T
s
Max.)
- Time (t
s
Min to t
s
Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
T
L
:
- Temperature (T
L
)
- Time (t
L
)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (T
p
) 260°C 240°C
Time within 5°C of actual Peak Temperature
(t
p
)
20 to 40 seconds 20 to 40 seconds
Ramp Down Rate 6°C / second Max. 6°C / second Max.
Time for T= 25°C to Peak Temperature, T
p
8 minutes Max. 6 minutes Max.
Table 9.1 Reflow Profile Parameter Values
Critical Zone: when
T is in the range
T to T
Temperature, T (Degrees C)
Time, t (seconds)
25
P
T = 25º C to T
t
p
T
p
T
L
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S