User's Manual

MAXON SD-125 RF LINK MODULE MAXON SD-125 RF LINK MODULE
Surface Mount Components
Surface mount components should always be replaced using a temperature controlled soldering system. The
soldering tools may be either a temperature controlled soldering iron or a temperature controlled hot-air
soldering station. A hot-air system is recommended for the removal of components on these boards. With
either soldering system, a temperature of 700° F (371° C) should be maintained.
The following procedures outline the removal and replacement of surface mount components. If a hot-air
soldering system is employed, see the manufacturer’s operating instructions for detailed information on the
use of your system.
 CAUTION: Avoid applying heat to the body of any surface mount component using standard soldering
methods. Heat should be applied only to the metalized terminals of the components. Hot-air systems do not
damage the components since the heat is quickly and evenly distributed to the external surface of the
component.
 CAUTION: The CMOS Integrated Circuit devices used in this equipment can be destroyed by static
discharges. Before handling one of these devices, service technicians should discharge themselves by
touching the case of a bench test instrument that has a 3-prong power cord connected to an outlet with a
known good earth ground. When soldering or desoldering a CMOS device, the soldering equipment should
have a known good earth ground.
Surface Mount Removal