User Manual
Table Of Contents
- 1. Overview
- 2. RF Module Operation
- 3. XBee ZigBee Networks
- Introduction to ZigBee
- ZigBee Stack Layers
- Networking Concepts
- ZigBee Application Layers: In Depth
- Coordinator Operation
- Router Operation
- End Device Operation
- Channel Scanning
- 4. Transmission, Addressing, and Routing
- 5. Security
- 6. Network Commissioning and Diagnostics
- 7. Managing End Devices
- 8. XBee Analog and Digital IO Lines
- 9. API Operation
- API Frame Specifications
- API UART Exchanges
- Supporting the API
- API Frames
- AT Command
- AT Command - Queue Parameter Value
- ZigBee Transmit Request
- Explicit Addressing ZigBee Command Frame
- Remote AT Command Request
- Create Source Route
- AT Command Response
- Modem Status
- ZigBee Transmit Status
- ZigBee Receive Packet
- ZigBee Explicit Rx Indicator
- ZigBee IO Data Sample Rx Indicator
- XBee Sensor Read Indicator
- Node Identification Indicator
- Remote Command Response
- Over-the-Air Firmware Update Status
- Route Record Indicator
- Many-to-One Route Request Indicator
- Sending ZigBee Device Objects (ZDO) Commands with the API
- Sending ZigBee Cluster Library (ZCL) Commands with the API
- Sending Public Profile Commands with the API
- 10. XBee Command Reference Tables
- 11. Module Support
- Appendix A: Definitions
- Appendix B: Agency Certifications
- Appendix C: Migrating from ZNet 2.5 to XBee ZB
- Appendix D: Additional Information
XBee®/XBee‐PRO®ZBRFModules
©2011DigiInternational,Inc. 17
Electrical Characteristics
Note – The signal-ended ADC measurements are limited in their range and only guaranteed for accuracy in
the range 0 to VREFI. The nature of the ADC’s internal design allows for measurements outside of this range
(+/- 200mV), but the accuracy of such measurements are not guaranteed.
Module Operation for Programmable Variant
The S2B modules that have the programmable option populated have a secondary processor with 32k of flash
and 2k of RAM. This allows module integrators to put custom code on the XBEE module to fit their own unique
needs. The DIN, DOUT, RTS, CTS, and RESET lines are intercepted by the secondary processor to allow it to be
in control of the data transmitted and received. All other lines are in parallel and can be controlled by either
the EM250 or the MC9S08QE micro (see Block Diagram for details). The EM250 by default has control of
certain lines. These lines can be released by the EM250 by sending the proper command(s) to disable the
desired DIO line(s) (see XBEE Command Reference Tables).
In order for the secondary processor to sample with ADCs, the XBEE pin 14 (VREF) needs to be connected to
a reference voltage.
Digi provides a bootloader that can take care of programming the processor over the air or through the serial
interface. This means that over the air updates can be supported through an XMODEM protocol. The processor
can also be programmed and debugged through a one wire interface BKGD (Pin 8).
DCCharacteristicsoftheXBee/XBee‐PRO
Symbol Parameter Condition Min Typical Max Units
V
IL
Input Low Voltage All Digital Inputs - - 0.2 * VCC V
V
IH
Input High Voltage All Digital Inputs 0.8 * VCC - - V
V
OL
Output Low Voltage VCC >= 2.7 V - - 0.18*VCC V
V
OH
Output High Voltage VCC >= 2.7 V 0.82*VCC - - V
I
IIN
Input Leakage Current
V
IN
= VCC or GND, all inputs, per pin
- - 0.5uA uA
I
OHS
Output source current (standard)
All digital outputs except
RSSI/PWM, DIO10, DIO4
4mA
I
OHH
Output source current (high
current)
RSSI/PWM, DIO10, DIO4 digital outputs 8 mA
I
OLS
Output sink current (standard
All digital inputs except
RSSI/PWM, DIO10, DIO4
4mA
I
OLH
Output sink current (high current) RSSI/PWM, DIO10, DIO4 digital outputs 8 mA
I
OH +
I
OL
Total output current for all I/O pins All digital outputs 40 mA
V
REFI
VREF Internal
EM250 has an internal reference that is
fixed
1.19 1.2 1.21 V
V
IADC
ADC input voltage range 0 VREFI V
R
IS
Input impedance When taking a sample 1 M Ohm
R
I
Input Impedance When not taking a sample 10 M Ohm