User Manual

MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd
2 Module overview
SLM550 module uses the Qualcomm solution based on Arm Cortex-A53 Quad-core applications
processor, with the highest main frequency of 4 * 2.0GHz, and the memory supports Dual-channel
LPDDR4X SDRAM. This module is suitable for broadband intelligent wireless communication modules
of TD-LTE/FDD-LTE/WCDMA/EVDO/TD-SCDMA/CDMA/GSM network standards.
The working frequency band supported by SLM550 module is:
SLM550-C SLM550-E SLM550-A
TDD-LTE :B34/38/39/40/41
FDD-LTE :B1/B3/B5/B8
WCDMA:B1/5/8
GSM:B3/8
TDSCDMA: B34/39
CDMA:BC0
EVDO:BC0
TDD-LTE:B38/40/41
FDD-LTE:B1/3/5/7/8/20/28A
WCDMA:B1/5/8
GSM:2/3/5/8
FDD-
LTE:B2/4/5/7/25/66
WCDMA:B2/4/5/8
GSM:B2/5
The physical interface of the module is a 274-pin pad that provides the following hardware interfaces:
⚫ Three 1.8V UART serial ports, supporting four or two wires.
⚫ Main LCD（MIPI interface）.
⚫ Two groups of Camera interface（MIPI data）.
⚫ A high-speed USB interface.
⚫ Three groups of Audio input interface.
⚫ Three groups of Audio output interface.
⚫ Dual- SIM card interface.
⚫ GPIO interface.
⚫ Five groups of I2C interfaces.
⚫ One sets of SPI interfaces.
⚫ TF card interface.
⚫ Support GNSS，WiFi，Bluetooth 4.1 functions.
2.1 Summary of features
Table 1 SLM550 features
Product
characteristics
Description
CPU Quad-core A53 (64bit) 2.0GHz
GPU Adreno 702 @845MHz
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