User Manual

MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd 53/89
Note:
The interface definition of the capacitive touch can be adjusted by software, and the user can change
the GPIO and I2C according to the design needs.
4.8 Audio Interface
The module provides three analog audio inputs, MIC_IN1_P for the main microphone, MIC_IN2_P for
the microphone, and MIC_IN3_P for the noise reduction microphone. The module also provides three
analog audio outputs (HPH_L/R, REC_P/N, LINE_OUT_P/N). The audio pin is defined as follows:
Table 11 Audio Pin Definitions
Name Pin Input/ Output Description
MIC_IN1_P 4 I Main MIC positive
MIC_IN2_P 6 I Headphone MIC positive
MIC_GND 5 I
Headphone MIC, Headphone MIC ，
noise reduction MIC negative
MIC_IN3_P 148 I Headphone MIC positive
MIC_IN1_N 178 I Main MIC negative
MIC_IN2_N 179 I Headphone MIC negative
MIC_IN3_N 180 I Noise reduction MIC positive
MIC_BIAS1 147 O BIAS voltage of the main MIC for silicon
MIC_BIAS2 155 O
BIAS voltage of the headphone MIC for
silicon wheat design
MIC_BIAS3 150 O BIAS voltage of the sub MIC for silicon
CDC_HPH_R 136 O Headphone right channel
CDC_HPH_L 138 O Headphone left channel
CDC_HSDET_L 139 I Headphone plug detection
CDC_HPH_REF 137 I Headphone reference ground
EAR_M 9 O Earpiece output negative
EAR_P 8 O Earpiece output positive