Product Manual

MeiGProductManualofSLM750Module
SLM750ModuleHardwareDesign Page 72, total 84 pages
GSM voice call GSM900 PCL=5 @32.21dBm 237.1 mA
DCS1800 PCL=0 @28.14dBm 200.7 mA
GSM850 PCL=5 @32.12dBm 243.9 mA
CDMA voice
call
BC0 @20.31dBm 556 mA
WCDMA voice
call
WCDMA Band 1@23.1dBm 461.8 mA
WCDMA Band 5@22.0dBm 574.3 mA
WCDMA Band 8@22.8dBm 559 mA
6.5 Environmental Reliability Requirements
Table 36: Environmental reliability requirements
Test item Test condition
Low temperature
storage test
-45℃, last for 24 hours in shutdown mode
High temperature
storage test
+90℃, last for 24 hours in shutdown mode
Temperature impact
test
In shutdown mode, last for 1 hour in -45℃ and +90℃. Temperature
conversion time is <3min, total 24 cycles.
High temperature high
humidity test
+85℃,95%RH,last for 48 hours in shutdown mode
Low temperature
operation test
-30℃,last for 24 hours in operation mode
High temperature
operation test
+75℃,last for 24 hours in operation mode
Vibration test Perform vibration tests as required in the following table:
Frequency Random vibration ASD(Acceleration
spectral density)
5~20Hz 0.96m
2
/s
3
20~500Hz 0.96m
2
/s
3
(20Hz),other -3dB/times
frequency range
Connector life test Board to board connector interface plugging 50 times; RF antenna
interface cable plugging 30 times
ESD test 1、The module tests the power PAD and the large area in the call
state, ESD meets:
1) Contact discharge shall pass ±4KV、±5KV test grade
2) Air discharge shall pass ±8KV、±10KV test grade
2、the module tests SIM card connector of EVB in shutdown mode,
ESD meets: