MeiG Smart product technical information SNM900 Hardware Design Guide Released Date:2020/11 File name: SNM900 Hardware Design Guide Verision Number：V1.02 Company: MeiG Smart Technology Co.
MeiG Smart product technical information IMPORTANT NOTICE COPYRIGHT NOTICE Copyright © MeiG Smart Technology Co., Ltd. All rights reserved. This information and its contents are owned by Meger Intelligent Technology Co., Ltd. and are protected by Chinese laws and applicable international conventions. Without the written authorization of Meger Intelligent Technology Co., Ltd.
MeiG Smart product technical information SNM900 Hardware Design Guide_V1.
MeiG Smart product technical information Foreword Thank you for using the SNM900 module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user.
MeiG Smart product technical information Contents Introduction.......................................................................................................................................................... 7 2.1 Summary of features...................................................................................................................................... 9 2.2 Block diagram ..................................................................................................................
MeiG Smart product technical information 6.5 SIM_VDD Characteristics .......................................................................................................................... 66 6.6 PWRKEY Feature ....................................................................................................................................... 67 6.7 VCOIN Feature............................................................................................................................................
MeiG Smart product technical information Date Version 2019-10-21 1.00 2020-2-17 1.01 2020-11 1.02 SNM900 Hardware Design Guide Version History Change description First edition Modify 3.
MeiG Smart product technical information 1. Introduction This document describes the hardware application interface of the module, including the connection of the circuit and the RF interface.It can help users quickly understand the interface definition, electrical performance, and structural dimensions of the module.Combining this document with other application documents, users can quickly use modules to design mobile communication applications.
MeiG Smart product technical information 2. Module overview The core board of SNM900 series adopts sdm660 of Qualcomm snapdragon 600 series. The CPU is made of 14nm FinFET, with 64bit arm and 8-core kryo 260 CPU (kryo Gold: Quad highperformance cores targeting 2.2 GHz, kryo silver: Quad low-power cores targeting 1.843 GHz). Main frequency 2.2g processor, support lpddr4 / 4x SDRAM memory.
MeiG Smart product technical information 2.1 Summary of features Table 2.1：SNM900 features Description Product Plateform Qualcomm SDM660 CPU Octa-core Kryo 260 CPU GPU Adreno512;650MHz System memory 32GB eMMC + 3GB LPDDR4X 1866Mhz compatible with 64GB+4GB,128GB+6GB OS Android 9.0 Size 45.5x41.0x3.0mm，Stamp hole package 160pin + 112pin LCC + LGA Wi-Fi WCN3980:IEEE 802.11b/g/n/ac 2.4G&5G Bluetooth BT 5.0 FM I won't support it DSDS(Dual Sim-card Dual Stanby) 3.0/1.
MeiG Smart product technical information Don’t support dual CDMA SIM card Display （screen/subscreen） Matrix: FULL HD: 2560*1600 60fps; LCD Size: User defined Interface: 1st LCM：MIPI DSI 4-lane; 2nd LCM：MIPI DSI 4-lane Interface: Support three sets of CSI, each group is 4-Lane Camera Camera (Front and Rear) Input Device Reset Pixel:Rear 16-16Mp/Front up to 16Mp ， Dual ISP can support dual 24MP Camera at the same time Video decode 4K30 8-bit: H.
MeiG Smart product technical information amplifier） One earpiece One stereo headphone(With headphone MIC) 2-channel digital mic signal (can support 4 digital MICs at the same time)Two I2S signal 2.
MeiG Smart product technical information 3. Module Package 3.1.Pin distribution diagram Figure 3.
MeiG Smart product technical information 3.2. Pin definitions table 3.1：Pin description Pin name Pin number Description Comment The module provides three VBAT power pin pins. The SNM900 operates from a single supply with a voltage range from 3.5V to 4.35V for VBAT.
MeiG Smart product technical information 92、94、 101、103、 111、116、 119、121、 135、144、 147、150、 154、155、 156、160、 161、170、 175、180、 181、210、 211、213、 214、215、 216、218、 220、222、 223、224、 252、257、 272 Main display interface(MIPI) MIPI_DSI0_CLK_N 64 O MIPI_DSI0_CLK_P 65 O MIPI_DSI0_LANE0_N 189 O MIPI_DSI0_LANE0_P 190 O MIPI_DSI0_LANE1_N 66 O MIPI_DSI0_LANE1_P 67 O MIPI_DSI0_LANE3_N 73 O MIPI_DSI0_LANE3_P 74 O MIPI_DSI0_LANE2_N 71 O MIPI_DSI0_LANE2_P 72 O GPIO53_LCD_RESET_N 75 I/O
MeiG Smart product technical information MIPI_DSI1_LANE1_P 239 O MIPI_DSI1_LANE2_N 244 O MIPI_DSI1_LANE2_P 243 O MIPI_DSI1_LANE3_N 246 O MIPI_DSI1_LANE3_P 245 O GPIO73 99 I/O LCD2 reset GPIO51 77 I/O LCD2 frame sync signal UART(1.
MeiG Smart product technical information GPIO47_SCAM_RST_N 79 I/O Front Camera reset GPIO50_SCAM_PWD_N 78 I/O Front Camera dormancy Rear Camera MIPI_CSI0_CLK_N 50 O MIPI_CSI0_CLK_P 49 O MIPI_CSI0_LANE0_N 56 I MIPI_CSI0_LANE0_P 55 I MIPI_CSI0_LANE1_N 194 I MIPI_CSI0_LANE1_P 193 I MIPI_CSI0_LANE2_N 52 I MIPI_CSI0_LANE2_P 51 I MIPI_CSI0_LANE3_N 54 I MIPI_CSI0_LANE3_P 53 I GPIO32_CAM_MCLK0 84 I/O Rear Camera main clock GPIO46_CAM0_RST_N 85 I/O Rear Camera reset GPI
MeiG Smart product technical information reduction MIC negative Noise reduction MIC positive MIC_IN3_P 131 I MIC_BIAS1 118 O MIC_BIAS2 117 O CDC_HPH_R 128 O The BIAS voltage of main MIC is used in the design of silicon wheat The BIAS voltage of the earphone MIC is used in the design of silicon wheat Right channel of earphone CDC_HPH_L 126 O Left channel of earphone CDC_HS_DET 125 I CDC_HPH_REF 127 I Headphone plug and detection Earphone reference GND CDC_EAR_M 129 O Earpiece ou
MeiG Smart product technical information GPIO6_I2C2_SDA 13 I/O GPIO7_I2C2_SCL 14 I/O GPIO2_I2C1_SDA 184 I/O GPIO3_I2C1_SCL 185 I/O GPIO30_I2C_SDA_8A 254 I/O GPIO31_I2C_SCL_8A 253 I/O Universal I2C signal Universal I2C signal Universal I2C signal TP GPIO14_TP_I2C4_SDA 234 I/O I2C data GPIO15_TP_I2C4_SCL 233 I/O I2C clock GPIO67_TP_INT_N 97 I/O TP interrupt GPIO66_TP_RST_N 98 I/O TP reset Pullup to VREG_L11A_1P 8 USB USB30_HS_DM 145 I/O USB 3.
MeiG Smart product technical information GPIO49_SPI_MOSI 261 I/O GPIO52_SPI_MISO 260 I/O GPIO22_I2C6_SDA 259 I/O GPIO23_I2C6_SCL 258 I/O GPIO8 232 I/O GPIO65 255 I/O GPIO74 256 I/O GPIO9 231 I/O GPIO63 166 I/O GPIO42 167 I/O GPIO43 168 I/O GPIO45 251 I/O GPIO68_ACCL_INT1 19 I/O GPIO71_ALSP_INT_N 20 I/O GPIO70_MAG_INT 21 I/O GPIO69_GYRO_INT 22 I/O GPIO72_PRESSURE_INT 221 I/O GPIO12 235 I/O GPIO56_FP_INT_N 270 I/O GPIO76 100 I/O GPIO73 99 I/O LPI
MeiG Smart product technical information GPIO75 204 I/O GPIO20_NFC_DWL_REQ 196 I/O GPIO106_TUNE 227 I/O Generic GPIO, without default configuration Generic GPIO, without default configuration Configure as RF tune enable GPIO105_TUNE 228/ I/O Configure as RF tune enable GPIO113 205 I/O PMU_GPIO4_NFC_CLK_RE Q 195 I/O PM660L_GPIO3_CODEC_CL K 197 I/O GPIO62 249 I/O GPIO27_MI2S_2_D1 266 I GPIO26_MI2S_2_D0 267 O GPIO25_MI2S_2_WS 268 O GPIO24_MI2S_2_SCK 269 O Generic GPIO, wi
MeiG Smart product technical information switch UUSB_TYPEC 183 I Type-c or Micro USB EDP_AUX_N 114 O DP interface auxiliary channel- EDP_AUX_P 115 O DP interface auxiliary channel+ CBL_PWR_N1 203 I Power on control pin DC_SNS 236 I DC power insertion detection PM660_KEY4_HOME 27 I Home key PM660L_KEY_UP 24 I Control volume+ BAT_CON_ID 148 I Battery ID detection Table 3.
MeiG Smart product technical information 24 25 PM660L_KEY_UP GPIO77_KEY2 26 GPIO64_KEY3 27 PM660_KEY4_HOME 28 GND 29 30 31 32 33 34 35 36 37 B-PD:nppukp Configurable KEY VOL+ GPIO77* B-PD:nppukp Configurable I/O,KEY VOL- GPIO64* B-PD:nppukp Configurable I/O,KEY B-PD:nppukp Configurable I/O,KEY HOME GND VREG_L5B_2P95 VREG_L2B_SDC2 GPIO54_SD_DET SDC2_SDCARD_D0 SDC2_SDCARD_D1 SDC2_SDCARD_D2 SDC2_SDCARD_D3 SDC2_SDCARD_CMD SDC2_SDCARD_CLK GPIO54* GND PO PMIC output 2.
MeiG Smart product technical information 57 GND 58 MIPI_CSI1_LANE1_P AI MIPI camera serial interface 1 lane1+ 59 MIPI_CSI1_LANE1_N AI MIPI camera serial interface 1 lane1- 60 MIPI_CSI1_LANE3_P AI MIPI camera serial interface 1 lane3+ 61 MIPI_CSI1_LANE3_N AI MIPI camera serial interface 1 lane3- 62 MIPI_CSI1_LANE0_P AI MIPI camera serial interface 1 lane0+ 63 MIPI_CSI1_LANE0_N AI MIPI camera serial interface 1 lane0- 64 MIPI_DSI0_CLK_N AO MIPI display serial interface 0 clock-
MeiG Smart product technical information 91 VREG_L17A_UIM2 92 GND 93 GPS_ANT 94 GND 95 96 CAM_I2C_SCL1 CAM_I2C_SDA1 PO GND AI GND GPIO39 B-PD:nppukp GPIO38 B-PD:nppukp PMIC output for UIM2 GND RF signal for GPS ANT GND Configurable I/O, Dedicated camera I2C1 SCL Configurable I/O, Dedicated camera I2C1 SDA 97 GPIO67_TP_INT_N GPIO67* B-PD:nppukp Configurable I/O,TP INT 98 GPIO66_TP_RESET_N GPIO66* B-PD:nppukp Configurable I/O,TP RESET 99 GPIO73 GPIO73* B-PD:nppukp Configurable I/
MeiG Smart product technical information 124 125 GND_MIC CDC_HS_DET GND Microphone bias filter ground AI MBHC mechanical insertion/removaldetection 126 CDC_HPH_L AO Headphone output, left channel 127 CDC_HPH_REF AI Headphone ground reference 128 CDC_HPH_R AO Headphone output, right channel 129 CDC_EAR_M AO Earpiece output, minus 130 CDC_EAR_P AO Earpiece output, plus 131 MIC_IN3_P AI Microphone input 3 132 MIC_IN2_P AI Microphone input 2 133 SPKR_DRV_M AO Class-D speake
MeiG Smart product technical information 158 159 160 GND GND GND GND GND 161 GND 162 USB1_SS_RX_P AI USB super-speed 1 receive – plus 163 USB1_SS_RX_M AI USB super-speed 1 receive – minus 164 GPIO10_I2C3_SDA GPIO10* B-PD:nppukp Configurable I/O, I2C SDA 165 GPIO11_I2C3_SCL GPIO11 B-PD:nppukp Configurable I/O, I2C SCL 166 GPIO63 GPIO63 B-PD:nppukp Configurable I/O 167 GPIO42 GPIO42* B-PD:nppukp Configurable I/O 168 GPIO43 GPIO43* B-PD:nppukp Configurable I/O 169 LPI
MeiG Smart product technical information 193 MIPI_CSI0_LANE1_P AI MIPI camera serial interface 0 lane1+ 194 MIPI_CSI0_LANE1_N AI MIPI camera serial interface 0 lane1- 195 PMU_GPIO4_NFC_CLK_REQ 196 GPIO20_NFC_DWL_REQ GPIO20 B-PD:nppukp PMU Configurable I/O B-PD:nppukp Configurable I/O B-PD:nppukp PMU Configurable I/O B-PD:nppukp Configurable I/O 197 PM660L_GPIO3_CODEC_CLK 198 GPIO60 199 Reserved Reserved 200 Reserved Reserved 201 202 USB_CC1 AI;AO USB_CC2 203 CBL_PWR_N1
MeiG Smart product technical information 227 GPIO106_TUNE GPIO106 B-PD:nppukp Configurable I/O for RF tune EN 228 GPIO105_TUNE GPIO105 B-PD:nppukp Configurable I/O for RF tune EN 229 USB20_HS_DM B-PD:nppukp USB2.0 data minus 230 USB20_HS_DP B-PD:nppukp USB2.
MeiG Smart product technical information 261 262 263 264 265 266 267 268 269 GPIO49_SPI_MOSI GPIO49* B-PD:nppukp Configurable I/O, SPI MOSI GPIO55* B-PD:nppukp Configurable pwdn GPIO48* B-PD:nppukp Configurable I/O, Depth camera reset GPIO34 B-PD:nppukp Configurable MCLK LPI_GPIO6 B-PD:nppukp Configurable LPI I/O, MI2S3_D0 GPIO27 B-PD:nppukp GPIO26 B-PD:nppukp GPIO25* B-PD:nppukp GPIO24 B-PD:nppukp GPIO56* B-PD:nppukp Configurable I/O, fingerprint INT LPI_GPIO5 B-PD:nppukp Con
MeiG Smart product technical information 3.3. Mechanical Dimensions Figure 3.2：TOP View & Side View Figure 3.
MeiG Smart product technical information z Figure 3.
MeiG Smart product technical information 4. Interface application 4.1. Power Supply In the case of a battery device, the voltage input range of the module VBAT is 3.5V to 4.35V, and the recommended voltage is 3.8V. It is recommended to use a large capacitor regulator close to VBAT. It is recommended to use two 47uF ceramic capacitors. Parallel 33PF and 10PF capacitors can effectively remove high frequency interference.
MeiG Smart product technical information Figure 4.2：DC-DC power supply circuit NOTE：If the user does not use battery power,please note that a 10K resistor is connected to the 149 pin(BAT_THERM) of the module and pulled down to GND to prevent the software from judging the abnormal batter temperature after the module is turned on,resulting in shutdown.the connection diagram is as follows: Figure 4.3：Connection diagram when not powered by battery 4.1.1.
MeiG Smart product technical information 4.2. Power on and off Do not turn on the module when the module's temperature and voltage limits are exceeded. In extreme cases, such operations can cause permanent damage to the module. 4.2.1. Module Boot The user can power on the module by pulling the KYPD_PWR_N1 pin (142) low. The pulldown time is at least 5 seconds. This pin has been pulled up to 1.8V in the module. The recommended circuit is as follows; or the CBL_PWR_N pin (203) is pulled low.
MeiG Smart product technical information The following figure is the boot timing description： Figure 4.7：Using PWRKEY boot timing diagram 4.2.2. Module Shutdown Users can use the PWRKEY pin to shutdown. 4.2.2.1 PWRKEY Shutdown The user can turn off the PWRKEY signal by pulling it down for at least 3 seconds. The shutdown circuit can refer to the design of the boot circuit.
MeiG Smart product technical information Figure 4.9： Reset Module Using External Signal When the pin is high, the voltage is typically 1.8V. Therefore, for users with a level of 3V or 3.3V, it is not possible to directly use the GPIO of the MCU to drive the pin. An isolation circuit is required. The hardware parameters of the RESET can refer to the following table: Table 4.
MeiG Smart product technical information Non-rechargeable battery powered: Figure 4.11：Non-rechargeable battery to power the RTC Rechargeable battery powered: Figure 4.12： Rechargeable Battery Powers RTC This VCOIN power supply is typically 3.0V. 4.4. Power Output The SNM900 has multiple power outputs. For SD card,SIM ,sensor,touch panel, LDO , etc. In application, it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interference.
MeiG Smart product technical information 4.5. Serial Port The SNM900 provides three serial ports for communication. And corresponding to three groups of I2C interfaces can be multiplexed into hardware flow control, note that the I2C interface can not be added to the UART_RTS/CTS when the pull resistor can be added. Table 4.
MeiG Smart product technical information When the serial level used by the user does not match the module, in addition to adding the level shifting IC, the following figure can also be used to achieve level matching. Only the matching circuits on TX and RX are listed here. Other low speed signals can refer to this two circuits. Figure 4.14：TX Connection Diagram Figure 4.15：RX Connection Diagram Note ：When using Levels Isolation in Figures 4.14 and 4.
MeiG Smart product technical information Table 4.4：Serial Port Hardware Parameters Description Minimum Maximum Unit Input low level Input high level Input low level Input high level - 0.63 V - V - 0.45 V 1.35 - V 1.17 Note：1. The serial port of the module is a CMOS interface, If necessary, please use the RS232 conversion chip. 2. If the 1.8V output of the module cannot meet the high level range of the user terminal, please add a level shifting circuit. 4.6.
MeiG Smart product technical information length between the signal line group and the group. The module's MIPI interface is a 1.2V power domain. When the user needs a compatible screen design, the module's LCD_ID pin or ADC pin can be used.LCD 2.8V power supply needs external LDO generation, LDO input power can use vreg_ BOB。 Table 4.
MeiG Smart product technical information GPIO51 77 I/O PM660L_PWM 112 O VREG_L11A_1P8 139 PO LCD2 frame sync signal Screen backlight PWM control 1.8V power supply LCD_ID of the module, this pin is internally GPIO. When used as LCD_ID, please confirm the internal circuit of LCD. If the internal divider of the LCD uses resistor divider, please pay attention to the voltage to meet the high or low range of GPIO. MIPI is a high-speed signal line.
MeiG Smart product technical information Among them, LDO_ 2p8 needs to be generated by external 2.8V LDO. Refer to Fig. 4.17 for LDO circuit. It is suggested to use two 2.8V LDOS to supply power to the main and auxiliary panels respectively in the design of main and auxiliary screens. Figure 4.17: LCD 2.8V LDO reference circuit SNM900 module has its own backlight drive output. Customers can directly use this function to drive LCM backlight.
MeiG Smart product technical information reference circuit provided in this document is a series-type PWM dimming backlight driver circuit; if it is a series-type one-line dimming backlight driver circuit, it needs to be controlled by GPIO. 4.6.2.MIPI Camera Interface The SNM900 module supports the MIPI interface Camera and provides a dedicated camera power supply. The main camera is a CSI0 interface that supports four sets of data lines and can support up to24M pixels.
MeiG Smart product technical information MIPI_CSI2_LANE1_P 191 I MIPI_CSI2_LANE1_N 192 I MIPI_CSI2_LANE2_P 46 I MIPI_CSI2_LANE2_N 47 I MIPI_CSI2_LANE3_P 44 I MIPI_CSI2_LANE3_N 45 I GPIO33_CAM_MCLK1 80 I/O Front camera clock signal GPIO47_SCAM_RST_N 79 I/O Front camera reset signal GPIO50_SCAM_PWD_N 78 I/O Front camera sleep signal CAM_I2C_SDA1 96 I/O I2C data CAM_I2C_SCL1 95 I/O I2C clock VREG_L11A_1P8 139 PO 1.
MeiG Smart product technical information Figure 4.19：Correct CAMERA connection diagram The MIPI interface has a high rate. The user should control the impedance by 100 ohms during the routing. Please pay attention to the length of the trace. It is not recommended to add a small capacitor on the MIPI signal line. This may affect the rising edge of the MIPI data. This in turn causes the MIPI data to be invalid.
MeiG Smart product technical information Figure 4.20：MIPI Camera Reference Circuit The power supply required by camera, including avdd-2.8v, afvdd-2.8v (focusing motor power supply) and dvdd-1.2v (CAM core voltage), can be designed with reference to the following LDO circuit Figure 4.21 camera power reference circuit Important note: When designing the camera function, you need to pay attention to the position of the connector.
MeiG Smart product technical information Figure 4.22：Camera imaging diagram 4.7.Resistive Touch Interface The module does not provide a resistive touch screen interface. If the user needs to use a resistive touch, an external dedicated chip is required. The module can provide an I2C interface. 4.8.CapacitiveTouch Interface The module provides a set of I2C interfaces that can be used to connect capacitive touches The default interface pins for capacitive touch software are defined as followsThe 2.
MeiG Smart product technical information audio pin is defined as follows: Table 4.
MeiG Smart product technical information 4.9.2 Microphone receiving Circuit On the right side is the MEMS microphone interface circuit, which has more bias power supply than electret mic. The negative signal of main mic must be designed with 0r to ground resistance close to MIC. As shown in Figure 4.24. Figure 4.24： Microphone Differential Interface Circuit 4.9.3.Headphone Interface Circuit The module integrates a stereo headphone jack.
MeiG Smart product technical information 2. We recommend that the headphone detection pin HS_DET and HPH_L form a detection circuit (the connection method in the above figure), because HPH_L has a pull-down resistor inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user will HS_DET and HPH_R To connect, please reserve a 1K pull-down resistor on HPH_R. 3. The standard of the headphone interface is the European standard OMPT.
MeiG Smart product technical information Table 4.9: pin definition of I2S interface Name Pin Intput/Output Description input DATA LPI_GPIO7_MI2S3_D1 212 I I2S3 LPI_GPIO6_MI2S3_D0 265 O I2S3output DATA LPI_GPIO5_MI2S3_WS 271 O I2S3_ WS LPI_GPIO4_MI2S3_SCLK 169 O I2S3_ SLK GPIO27_MI2S_2_D1 266 I I2S2 input DATA GPIO26_MI2S_2_D0 267 O I2S2 output DATA GPIO25_MI2S_2_WS 268 O I2S2_WS GPIO24_MI2S_2_SCK 269 O I2S2_SCK 4.10. USB Interface The SNM900 supports a USB 2.0 /3.
MeiG Smart product technical information The module also supports OTG function and can output 5V / 1.5A current The voltage input range during charging is as follows: Table 4.11：Voltage input range during charging Name Description Minimum Typical Maximum Unit VBUS Input range 4 - 6 V The USB plug-in detection of the module is realized by the VBUS and DP/DM data lines.
MeiG Smart product technical information USB30_HS_DP 146 USB_ID 143 USB DateUSB ID The recommended circuit diagram of USB OTG is as follows: Figure 4.30： USB-OTG Connection Diagram 4.11. Charging Interface SNM900 module is internally integrated with 3A charging scheme. The charging related contents in this manual are only described by internal charging scheme. The sdm660 platform uses the internal integrated charging chip of Qualcomm pm660 by default, and supports the charging protocol of qc3.0 & 4.
MeiG Smart product technical information temperature coefficient) inside the battery to connect the thermistor to the BAT_THERM pin. During the charging process, the software reads the voltage of the BAT_THERM pin to determine if the battery temperature is too high. If the temperature is too high or too low, the battery will stop charging immediately to prevent battery damage. The battery charging connection diagram is shown below: Figure 4.31：Charging circuit connection diagram 4.
MeiG Smart product technical information 4.13. SD Card Interface SNM900 supports SD card interface and supports up to 128GB. The reference circuit is as follows: Figure 4.33： SD Card Interface Circuit 4.14 I2C Bus Interface The SNM900 module supports seven hardware I2C bus interfaces and Two camera-specific CCI interface. The pin definitions and default functions are as follows: Table 4.
MeiG Smart product technical information Note: To use the 2.2KΩ pull-up resistor to 1.8V when used as an I2C bus interface, refer to Table 3.1 - I2C Interface. 4.15 Analog to Digital Converter (ADC) SNM900 module is provided by power management chip with two ADC: adc4 (4Pin) and adc5 (209pin) The ADC signal is 16 bit resolution, and its performance parameters are as follows: Table 4.14: ADC Performance Parameters Description Minimum Typical Maximum Unit Input Voltage Range - 1.
MeiG Smart product technical information 4.18.1 Main Antenna The module provides the MAIN antenna interface pin Pin1 RF_MAIN. The antenna on the user's main board should be connected to the antenna pin of the module using a 50-ohm characteristic microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows: Figure 4.
MeiG Smart product technical information antenna matching network should be added. The recommended circuit diagram is as follows: Figure 4.37: DRX antenna interface connection circuit In the figure, R102, C103, and C104 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R102 defaults to 0R, C103 and C104 are not posted by default.
MeiG Smart product technical information Figure 4.39：Connecting Active Antennas 4.18.4 WiFi/BT antenna The module provides the WiFi/BT antenna pin RF_WIFI/BT. The antenna on the user's motherboard should be connected to the antenna pin of the module using a 50 ohm microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows: ： Figure 4.
MeiG Smart product technical information Figure 4.41：WIFI_BT antenna interface simplified connection circuit In the above figure, R301 defaults to 0R, and C301 and C302 do not paste by default.
MeiG Smart product technical information 5.PCB Layout The performance of a product depends largely on the PCB trace. As mentioned above, if the PCB layout is unreasonable, it may cause interference problems such as card loss. The way to solve these interferences is often to redesign the PCB. If you can plan a good PCB layout in the early stage, the PCB traces smoothly, saving a lot of time. Of course, it can also save a lot of costs.
MeiG Smart product technical information The length of the RF cable between the antenna pin of the module and the antenna connector should be as short as possible. The situation of crossing the entire PCB should be absolutely avoided. If the antenna is connected by a coaxial RF line, care should be taken to avoid the coaxial RF line spanning the SIM card, power supply circuit, and high-speed digital circuits to minimize the effects of each other. 5.2.
MeiG Smart product technical information pairs. 100 ohm differential impedance matching is performed. Ensure impedance consistency and do not bridge different GND planes as much as possible. The MIPI interface selects a small-capacity TVS when selecting an ESD device. It is recommended that the parasitic capacitance be less than 1pF.
MeiG Smart product technical information The conducted interference is mainly caused by the voltage drop of VBAT. If the Audio PA is directly powered by VBAT, it is easier to hear the “zizi” sound at the SPK output. Therefore, it is better to connect in parallel with the input of the Audio PA in the schematic design. Some large capacitance capacitors and series magnetic beads. 5.2.7. Other The serial port interface of the module should also be kept as short as possible.
MeiG Smart product technical information 6. Electrical, Reliability 6.1 Absolute Maximum The table below shows the absolute maximum values that the module can withstand. Exceeding these limits can cause permanent damage to the module. Table 6.1: Absolute Maximum Parameter Minimum Typical Maximum Unit VBAT --0.5 - 6 V VBUS --0.3 - 16 V Peak current - - 3 A 6.2 Working Temperature The table below shows the operating temperature range of the module: Table 6.
MeiG Smart product technical information 1.65 1.8 1.95 - 2.95 - - - 55 mA Description Minimum Typical Maximum Unit High level 1.4 - - V Low level - - 0.6 V Effective time 2000 VO Output voltage IO Output current V 6.6 PWRKEY Feature Table 6.6: PWRKEY Characteristics Parameter PWRKEY ms 6.7 VCOIN Feature Table 6.7: VCOIN Characteristics Parameter Description VCOIN-IN VCOIN input voltage VCOIN-OUT VCOIN Output voltage Minimum Typical Maximum Unit 2.1 3.0 3.
MeiG Smart product technical information Imax Peak current Power control at maximum output power - - 3 A 6.9 Electrostatic Protection The module is not specifically protected against electrostatic discharge. Therefore, users must pay attention to electrostatic protection when producing, assembling, and operating module 6.10 WIFI Main RF Performance The table below lists the WIFI conduction Transmission performance(2.4G) 802.11B 802.11G 802.
MeiG Smart product technical information 7. Production 7.1. Top And Bottom Views Of The Module Figure7.
MeiG Smart product technical information 7.2. Recommended Soldering Furnace Temperature Curve Figure7.2: Module recommended soldering furnace temperature curve 7.3. Humidity Sensitivity (MSL) The SNM900 module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-020C specification in accordance with the IPC/JEDEC standard under ambient conditions of temperature <30 degrees and relative humidity <60%.
MeiG Smart product technical information 7.4. Baking Requirements Due to the humidity sensitivity of the module, the SNM900 should be thoroughly baked prior to reflow soldering, otherwise the module may cause permanent damage during reflow soldering. The SNM900 should be baked for 192 hours in a cryogenic vessel at 40°C +5°C/0°C and a relative humidity of less than 5%, or in a high temperature vessel at 80°C±5°C.Bake for 72 hours. Users should note that the tray is not resistant to high temperatures.
MeiG Smart product technical information 8. Support Peripheral Device List SNM900 peripheral devices can support the devices included in the platform QVL. The following are the default software adapter devices. Table 8.1: List of supported display models Vendor Drive IC Specification Zoneway ILI9881P 1280x720 Drive IC Specification Ambitious s5k3m2xx 13M Ambitious s5k4h7 8M Shun Yu S5K5E8 5M Table 8.2: Support for Camera Model List Vendor Table 8.
MeiG Smart product technical information 9. Appendix 9.1. Related Documents Table 9.1: Related documents Serial Comment numb File name er [1] GSM 07.07： Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) [2] GSM 07.10： Support GSM 07.10 multiplexing protocol [3] GSM 07.05： [4] GSM 11.14： [5] GSM 11.11： [6] GSM 03.38： [7] GSM 11.
MeiG Smart product technical information GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate IMEI International Mobile Equipment Identity Li-ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication System, also referred to as GSM 1900
MeiG Smart product technical information 9.3. Multiplexing function Table 9.
MeiG Smart product technical information 9.4. Safety Warning Pay attention to the following safety precautions when using or repairing any terminal or mobile phone that contains modules. The user should be informed of the following safety information on the terminal device. Otherwise, Meig will not be responsible for any consequences caused by the user not following these warning actions. Table 9.4: Security Warnings FCC Caution. § 15.19 Labelling requirements.
5)All types of antennas that can be used with a transmitter：External antenna with maximum gain not Exceeding6.49dBi. 1.4Trace antenna designs: Not applicable. 1.5RF exposure considerations: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator & your body. 1.6Antennas: The module does not have a standard antenna. 1.
