User Guide

MESHTEK-H52E
ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/ P a g e 12 | 13
6. PRODUCT HANDLING
6.1. SOLDER REFLOW PROFILE
Soldering Temperature-Time Profile for Reflow Soldering is described below in FIGURE 5. Maximum number
of cycles for reflow is 2. No opposite side reflow is allowed due to module weight.
Figure 5: REFLOW PROFILE
6.2. MOISTURE SENSITIVITY LEVELS
The Moisture Sensitivity Level (MSL) relates to the required packaging and handling precautions. MeshTek-
H52E module is rated for MSL 3, 168-hour floor life after opening.
Note: For MSL standards, see IPC/JEDEC J-STD-020, which can be downloaded from www.jedec.org.