Assembly Instructions

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08/06/2016
12:12:02
GPS2-Mechanical.SchDoc
Title
Number
Date
File:
Revisio n
Sheet
of
Time
A3
Gen3-3GBoa rd
Dwn
Chk
Date
By
App
RVL
Unit 1, Crundalls
Gedges Hill
Matfield
Tonbridge
Kent, UK
TN12 7EA
Tel : [phone]
Fax : [phone]
[e-mail]
Printed
Copyright
R Penderis
M Leman
Michelin
P Smith
Cli ent
08/06/2016May 2016
May 2016
May 2016
Michelin
Gen3 3G/GPS Module - MECHANICAL
PCB Assembly / Piggyback Board
PCB1
564-05-04
GEN3 MAIN TRANSCEIVER 3G/GPS PCB
Colour schemes used for Signals/Info:
Inputs / Bi-directional = Indigo
Outputs = Orange
Comm busses / Eval Notes = Green
Important issues = Red
General information = Blue
Fiducial 2 layer (not a part on BOM)
Fid1
Fiducial 2 layer (not a part on BOM)
Fid2
Fiducial 2 layer (not a part on BOM)
Fid3
DESIGN COMPONENT CHOICES:
- All components have a minimum temperature range of -40/+85 C unless marked otherwsie
DESIGN MODIFICATION HISTORY:
PCB No 564-05-02 to 564-04-03 (Version 2 to Version 3):
- Changed SIM socket from Yamaichi to Amphenol (lower cost)
- Fixed SIM card detection fault (incorrectly attached to ESD device))
- Updated level translator IC modification (added bufer and FET)
- Changed Top & Bottom layers GROUND Plane polygon and moved it away from edges
- Moved as many Testpoints to Top Silkscreen layer as possible
- Upgraded all Testpoints to 0.5mm holes (for easier attachment of mods wires)
- Corrected PCB Name
- Adjusted Power & Ground Planes pullback on PCB edges
DESIGNED:
SCH REVISION:
BY: RASTERVISION Ltd
May 2016
4.0.0
PCB REVISION: 564-05-04
PIFid100
COFid1
PIFid200
COFid2
PIFid300
COFid3
COPCB1