Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsIntegrated Circuits (ICs)EEPROM SOIC 8 1 kBit 128 x 8

 2003 Microchip Technology Inc. DS21711C-page 1

24AA01/24LC01B

Device Selection Table

Features

• Single-supply with operation down to 1.8V

• Low-power CMOS technology

- 1 mA active current typical

-1µA standby current typical (I-temp)

• Organized as 1 block of 128 bytes (1 x 128 x 8)

• 2-wire serial interface bus, I

C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (24AA01) and 400 kHz (24LC01B)

compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 8 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP and MSOP packages

• 5-lead SOT-23 package

• Standard and Pb-free finishes

• Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description

The Microchip Technology Inc. 24AA01/24LC01B

(24XX01*) is a 1 Kbit Electrically Erasable PROM. The

device is organized as one block of 128 x 8-bit memory

with a 2-wire serial interface. Low-voltage design

permits operation down to 1.8V with standby and active

currents of only 1 µA and 1 mA, respectively. The

24XX01 also has a page write capability for up to 8

bytes of data. The 24XX01 is available in the standard

8-pin PDIP, surface mount SOIC, TSSOP and MSOP

packages and is also available in the 5-lead SOT-23

package.

Package Types

Block Diagram

Part

Number

VCC

Range

Max Clock

Frequency

Temp

Ranges

24AA01 1.8-5.5 400 kHz

(1)

24LC01B 2.5-5.5 400 kHz I, E

Note 1: 100 kHz for V

CC <2.5V

24XX01

SCL

SDA

PDIP/SOIC/TSSOP/MSOP

SOT-23-5

24XX01

SCL

SDA

Note: Pins A0, A1 and A2 are not used by the

24XX01 (no internal connections).

HV Generator

EEPROM

Array

Page Latches

YDEC

XDEC

Sense Amp.

Memory

Control

Logic

I/O

Control

Logic

I/O

SDA

SCL

VSS

R/W Control

1K I

™

Serial EEPROM

Summary of content (24 pages)

PAGE 1
24AA01/24LC01B 1K I2C™ Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA01 1.8-5.5 400 kHz(1) I 24LC01B 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP 1 A1 2 A2 3 VSS 4 Note: 8 VCC 7 WP 6 SCL 5 SOT-23-5 SCL 1 VSS 2 SDA SDA 3 24XX01 A0 24XX01 • Single-supply with operation down to 1.
PAGE 2
4AA01/24LC01B 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ..........................................................................
PAGE 3
24AA01/24LC01B TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param. No. Sym Characteristic VCC = +1.8V to +5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Min Typ Max Units Conditions 1 FCLK Clock frequency — — — — 400 100 kHz 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V (24AA01) 2 THIGH Clock high time 600 4000 — — — — ns 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC <2.5V (24AA01) 3 TLOW Clock low time 1300 4700 — — — — ns 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.
PAGE 4
24AA01/24LC01B FIGURE 1-1: BUS TIMING DATA 5 4 2 3 SCL 7 SDA IN 8 10 9 6 14 12 11 SDA OUT FIGURE 1-2: BUS TIMING START/STOP D4 SCL 6 7 10 SDA Start DS21711C-page 4 Stop  2003 Microchip Technology Inc.
PAGE 5
24AA01/24LC01B 2.0 FUNCTIONAL DESCRIPTION The 24XX01 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while defining a device receiving data as a receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX01 works as slave.
PAGE 6
24AA01/24LC01B 3.6 FIGURE 3-2: Device Addressing A control byte is the first byte received following the Start condition from the master device. The control byte consists of a four-bit control code. For the 24XX01, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are ‘don’t care’s’ for the 24XX01. The last bit of the control byte defines the operation to be performed. When set to ‘1’, a read operation is selected.
PAGE 7
24AA01/24LC01B 4.0 WRITE OPERATION 4.1 Byte Write 4.2 The write control byte, word address and first data byte are transmitted to the 24XX01 in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 8 data bytes to the 24XX01, which are temporarily stored in the on-chip page buffer and will be written into the memory once the master has transmitted a Stop condition.
PAGE 8
24AA01/24LC01B 5.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0).
PAGE 9
24AA01/24LC01B 7.0 READ OPERATION 7.3 Sequential Read Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. Sequential reads are initiated in the same way as a random read, except that once the 24XX01 transmits the first data byte, the master issues an acknowledge (as opposed to a Stop condition in a random read).
PAGE 10
24AA01/24LC01B FIGURE 7-2: RANDOM READ S BUS ACTIVITY T A MASTER R T S SDA LINE A C K BUS ACTIVITY FIGURE 7-3: BUS ACTIVITY MASTER S T A R T S WORD ADDRESS (n) CONTROL BYTE CONTROL BYTE A C K S T O P P DATA (n) A C K N O A C K SEQUENTIAL READ CONTROL BYTE DATA (n) DATA (n + 1) DATA (n + 2) S T O P DATA (n + X) P SDA LINE BUS ACTIVITY DS21711C-page 10 A C K A C K A C K A C K N O A C K  2003 Microchip Technology Inc.
PAGE 11
24AA01/24LC01B 8.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 8-1. TABLE 8-1: PIN FUNCTION TABLE Name PDIP SOIC TSSOP A0 1 1 1 1 — Not Connected A1 2 2 2 2 — Not Connected A2 3 3 3 3 — Not Connected VSS 4 4 4 4 2 Ground SDA 5 5 5 5 3 Serial Address/Data I/O SCL 6 6 6 6 1 Serial Clock WP 7 7 7 7 5 Write-Protect Input VCC 8 8 8 8 4 +1.8V to 5.5V Power Supply 8.1 MSOP SOT23 A0, A1, A2 Description 8.
PAGE 12
24AA01/24LC01B 9.0 PACKAGING INFORMATION 9.
PAGE 13
24AA01/24LC01B 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B
PAGE 14
24AA01/24LC01B 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .
PAGE 15
24AA01/24LC01B 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 A2 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN INCHES NOM MAX 8 .026 .033 .002 .246 .169 .114 .
PAGE 16
24AA01/24LC01B 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .
PAGE 17
24AA01/24LC01B 5-Lead Plastic Small Outline Transistor (OT) (SOT-23) E E1 p B p1 n D 1 α c A φ L β Units Dimension Limits n p Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic p1 A A2 A1 E E1 D L φ c B α β MIN .035 .035 .000 .102 .059 .110 .014 0 .
PAGE 18
24AA01/24LC01B APPENDIX A: REVISION HISTORY Revision C Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC01B standard marking code. DS21711C-page 18  2003 Microchip Technology Inc.
PAGE 19
24AA01/24LC01B ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site.
PAGE 20
24AA01/24LC01B READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 21
24AA01/24LC01B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. X PART NO. Device /XX Temperature Package Range X Lead Finish Examples: a) b) Device: = 1.8V, 1 Kbit I2C™ Serial EEPROM = 1.8V, 1 Kbit I2C Serial EEPROM (Tape and Reel) 24LC01B: = 2.5V, 1 Kbit I2C Serial EEPROM 24LC01BT: = 2.
PAGE 22
24AA01/24LC01B NOTES: DS21711C-page 22  2003 Microchip Technology Inc.
PAGE 23
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 24
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