User Manual
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp.
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Content
1. Introduction ...................................................................................................................... 3
1.1. Major Components ....................................................................................................................................... 3
1.2. Features ........................................................................................................................................................ 3
1.3. Application .................................................................................................................................................... 4
1.4. Certifications ................................................................................................................................................. 4
2. Product Specification ...................................................................................................... 5
2.1. Chipset .......................................................................................................................................................... 5
2.2. Interfaces ...................................................................................................................................................... 5
2.3. Hardware Design Considerations ................................................................................................................. 5
3. Hardware Architecture ................................................................................................... 10
4. Compatibility Requirements .......................................................................................... 10
5. Environmental Requirements ....................................................................................... 11
5.1. Temperature ............................................................................................................................................... 11
5.2. Humidity ...................................................................................................................................................... 11
Appendix A: Dimension and Foot Print ................................................................................. 12
Appendix B: Product Image .................................................................................................... 13
Appendix C: PIN Assignment ................................................................................................. 14
Appendix D: Reflow Profile ..................................................................................................... 16
Appendix E: Schematic ........................................................................................................... 17
Appendix F: Reference Schematic ......................................................................................... 18
Appendix G: Test Board Layout Information ......................................................................... 19
Appendix H: Test Board Layout Information ......................................................................... 19
Appendix H: Label Information ............................................................................................... 19
Appendix I: Packaging Information ........................................................................................ 20
Appendix I: Reversion History ................................................................................................ 21