User Manual

BM62/64

Preliminary

 2017 Microchip Technology Inc.

DS60001403C-Page 55

9.0 SOLDERING

RECOMMENDATIONS

The BM62/64 module is assembled using a standard

lead-free reflow profile, IPC/JEDEC J-STD-020. The

BM62/64 module can be soldered to the main PCB

using a standard leaded and lead-free solder reflow

profiles.

To avoid the damage to the module, follow these recom-

mendations:

• Refer to Microchip Technology Application Note

“AN233 Solder Reflow Recommendation”

(DS00233) for the soldering reflow recommenda-

tions

• Do not exceed peak temperature (T

) of +260ºC

• Refer to the “Solder Paste” data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash the module, as moisture can be

trapped under the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow

Figure 9-1 illustrates the reflow profile of the BM62/64

module.

FIGURE 9-1: REFLOW PROFILE