Datasheet of Bluetooth BM87SPPS5MC2 Module ISSC Technologies Corp. Revision History Date 2013/09/05 Revision Content The first version Version 0.
Content 1. Introduction ...................................................................................................................... 3 1.1. Major Components ................................................................................................................................. 3 1.2. Features ................................................................................................................................................. 3 1.3. Application ............................
1. Introduction Part Name: ISSC BM87SPPS5MC2 Bluetooth module Part Number: BM87SPPS5MC2-xxxxxx The ISSC BM87SPPS5MC2 Bluetooth module is designed for both MFi (The Made for iPhone, iPad and iPod badge) and Bluetooth SPP App-Enabled Accessories with audio solution. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.
Product Specification 1.4. Chipset 7x7 mm2 56 pin QFN IS1687SM 1.5. Interfaces - Multi function GPIO interface - Bluetooth RF interface - UART up to 921600 bps - I2C for external EEPROM and authentication chip - UART interface for external peripherals control. - Serial audio interface CONFIDENTIAL © 2000~2013 ISSC Technologies Corp.
Hardware Architecture Block Diagram Power Tree 2. Compatibility Requirements The BM87SPPS5MC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility and reliability, and software compatibility test. CONFIDENTIAL © 2000~2013 ISSC Technologies Corp.
3. Environmental Requirements 3.1. Temperature Conditions Operating Temperature Non-Operating Temperature Minimum - 40 ℃ - 40℃ Maximum +85 ℃ +85 ℃ Conditions Operating Humidity Non-Operating Humidity Minimum 10% 5% Maximum 90% 95% 3.2. Humidity CONFIDENTIAL © 2000~2013 ISSC Technologies Corp.
Appendix A: Dimension and Foot Print 1. Dimension & Foot Print - Dimension: 25.7 mm* 14.3 mm* 1.86 mm (Length* Width* Height) - Tolerance: +/- 0.25 mm Appendix B: Product Image CONFIDENTIAL © 2000~2013 ISSC Technologies Corp.
Appendix C: Reflow Profile 1.) Follow: IPC/JEDEC J-STD-020 C 2.) Condition: Average ramp-up rate (217℃ to peak): 1~2℃/sec max. Preheat：150~200C、60~180 seconds Temperature maintained above 217℃ : 60~150 seconds Time within 5℃ of actual peak temperature: 20 ~ 40 sec. Peak temperature：250+0/-5℃ or 260+0/-5℃ Ramp-down rate : 3℃/sec. max. Time 25℃ to peak temperature : 8 minutes max. Cycle interval：5 minus Slope: 1~2℃/ sec max. (217℃ to peak) Peak: 250+0/-5℃ Or 260+0/-5℃ Ramp down rate: Max. 3℃/sec.
same meaning may be used. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Appendix E: Packaging Information TBA CONFIDENTIAL © 2000~2013 ISSC Technologies Corp.
