User`s guide

MCP1630 DUAL BUCK DEMO
BOARD USER’S GUIDE
© 2005 Microchip Technology Inc. DS51531A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Chapter 1. Product Overview........................................................................................ 5
1.1 Introduction ............................................................................................... 5
1.2 What is the MCP1630 Dual Buck Demo Board? ...................................... 6
1.3 What the MCP1630 Dual Buck Demo Board Kit Includes ........................ 6
Chapter 2. Installation and Operation .......................................................................... 7
2.1 Introduction ............................................................................................... 7
2.2 Features ................................................................................................... 7
2.3 Getting Started ......................................................................................... 7
Appendix A. Schematic and Layouts ........................................................................ 11
A.1 Introduction and Highlights ..................................................................... 11
A.2 Board Schematic - Sheet 1 ................................................................... 12
A.3 Board Schematic - Sheet 2 ................................................................... 13
A.4 Board Outline ........................................................................................ 14
A.5 Board Top Layer ................................................................................... 15
A.6 Board Mid-Layer 1 ................................................................................ 16
A.7 Board Mid-Layer 2 ................................................................................ 17
A.8 Board Bottom Layer .............................................................................. 18
Appendix B. Bill-Of-Materials (BOM) ......................................................................... 19
Appendix C. Evaluation Board Firmware .................................................................. 21
C.1 Device Firmware ..................................................................................... 21
Worldwide Sales and Service .................................................................................... 22