Datasheet

MCP23008/MCP23S08
DS21919E-page 36 © 2007 Microchip Technology Inc.
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 20
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 4.00 BSC
Exposed Pad Width E2 2.60 2.70 2.80
Overall Length D 4.00 BSC
Exposed Pad Length D2 2.60 2.70 2.80
Contact Width b 0.18 0.25 0.30
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –
D
EXPOSED
PAD
E
E2
2
1
N
TOP VIEW
NOTE 1
N
L
K
b
e
D2
2
1
A
A1
A3
BOTTOM VIEW
Microchip Technology Drawing C04-126B