Datasheet
Table Of Contents
- Features
- CMOS Technology
- Packages
- Package Types
- Block Diagram
- 1.0 Device OvervieW
- 1.1 Pin Descriptions
- 1.2 Power-on Reset (POR)
- 1.3 Power-up Timer (PWRT)
- 1.4 Clock Generator
- 1.5 I2C Bus Interface/ Protocol Handler
- 1.6 Address Decoder
- 1.7 Register Block
- 1.8 Serializer/Deserializer
- 1.9 Interrupt Logic
- 2.0 Electrical Characteristics
- 2.1 DC Characteristics
- TABLE 2-1: DC Characteristics
- FIGURE 2-1: respOnse time
- TABLE 2-2: response time
- FIGURE 2-2: TEST POINT Clock Timing
- TABLE 2-3: TEST POINT Clock Timing
- TABLE 2-4: Power-up Timer Requirements
- FIGURE 2-3: I2C Bus Start/Stop Bits Timing
- FIGURE 2-4: I2C Bus Data Timing
- TABLE 2-5: I2C Bus Data Requirements
- FIGURE 2-5: GP0 and GP1 POrt Timings
- 2.1 DC Characteristics
- 3.0 Package InFormation
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS20090C-page 29
MCP23016
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. § Significant Characteristic.
3
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 28
Pitch e 1.27 BSC
Overall Height A – – 2.65
Molded Package Thickness A2 2.05 – –
Standoff § A1 0.10 – 0.30
Overall Width E 10.30 BSC
Molded Package Width E1 7.50 BSC
Overall Length D 17.90 BSC
Chamfer (optional) h 0.25 – 0.75
Foot Length L 0.40 – 1.27
Footprint L1 1.40 REF
Foot Angle Top φ 0° – 8°
Lead Thickness c 0.18 – 0.33
Lead Width b 0.31 – 0.51
Mold Draft Angle Top α 5° – 15°
Mold Draft Angle Bottom β 5° – 15°
c
h
h
L
L1
A2
A1
A
NOTE 1
12
3
b
e
E
E1
D
φ
β
α
N
Microchip Technology Drawing C04-052
B