Datasheet

© 2007 Microchip Technology Inc. DS21919E-page 39
MCP23008/MCP23S08
APPENDIX A: REVISION HISTORY
Revision E (August 2007)
1. Section 3.0 “Packaging Information”:
Updated package outline drawings.
Revision D (February 2007)
1. Changed Byte and Sequential Read in
Figure 1-1 from “R” to “W”.
2. Table 2-4, Param No. 51 and 53: Changed from
450 to 600 and 500 to 600, respecively.
3. Added disclaimer to package outline drawings.
4. Updated package outline drawings.
Revision C (October 2006)
1. Added 20-pin QFN package information
throughout document.
2. Added disclaimer to package outline drawings.
Revision B (February 2005)
The following is the list of modifications:
1. Section 1.6 “Configuration and Control Reg-
isters”. Added Hardware Address Enable
(HAEN) bit to Table 1-3.
2. Section 1.6.6 “Configuration (IOCON) Regis-
ter”. Added Hardware Address Enable (HAEN)
bit to Register 1-6.
Revision A (December 2004)
• Original Release of this Document.