Datasheet

© 2008 Microchip Technology Inc. DS22103A-page 3
MCP23018/MCP23S18
Package Types:
MCP23S18
PDIP/SOIC QFN *
NC28
GPA727
GPA626
GPA525
GPA424
GPA323
GPA222
GPA121
GPA020
INTA19
INTB18
NC17
RESET16
SO15
VSS 1
NC 2
GPB0 3
GPB1 4
GPB2 5
GPB3 6
GPB4 7
GPB5 8
GPB6 9
GPB7 10
VDD 11
CS 12
SCK 13
SI 14
GPA6 21 GPA7 22
VSS 23
GPA5 20 GPA4 19
GPA318
GPA217
GPA116
GPA015
INTA *14
GPB1 1
GPB2 2
GPB3 3
GPB4 4
GPB5 5
VDD 8
CS
9
SCK
10
SI
11
SO
12
GPB0 24
GPB6 6
GPB7
7
RESET13
EP
25
* INTB is not bonded out. Can be controlled in
IOCON.MIRROR