Datasheet

© 2008 Microchip Technology Inc. DS22103A-page 53
MCP23018/MCP23S18
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device MCP23018: 16-Bit I/O Expander w/ I
2
C™ Inter-
face
MCP23018T: 16-Bit I/O Expander w/ I
2
C Interface
(Tape and Reel)
MCP23S18: 16-Bit I/O Expander w/ SPI Interface
MCP23S18T: 16-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
Temperature
Range
E= -40°C to +125°C (Extended) *
Package MJ = Plastic Quad Flat, No Lead Package
(4x4x0.9 mm Body), 24-Lead
SP = Skinny Plastic DIP (300 mil Body), 28-Lead
SO = Plastic SOIC (300 mil Body), 28-Lead
SS = SSOP, (209 mil Body, 5.30 mm), 24-Lead
PART NO. X /XX
PackageTemperature
Range
Device
Examples:
a) MCP23018-E/SP: Extended Temp.,
28LD SPDIP package.
b) MCP23018-E/SO: Extended Temp.,
28LD SOIC package.
c) MCP23018T-E/SO: Tape and Reel,
Extended Temp.,
28LD SOIC package.
d) MCP23018-E/SS: Extended Temp.,
24LD SSOP package.
e) MCP23018T-E/SS: Tape and Reel,
Extended Temp.,
24LD SSOP package.
f) MCP23018-E/MJ: Extended Temp.,
24LD QFN package.
a) MCP23S18-E/SP: Extended Temp.,
28LD SPDIP package.
b) MCP23S18-E/SO: Extended Temp.,
28LD SOIC package.
c) MCP23S18T-E/SO: Tape and Reel,
Extended Temp.,
28LD SOIC package.
d) MCP23S18T-E/MJ: Tape and Reel,
Extended Temp.,
24LD QFN package.
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