Datasheet
Table Of Contents
- Features
- Applications
- Description
- Package Types
- Functional Block Diagram
- 1.0 Electrical Characteristics
- PIN FUNCTION TABLE
- electrical characteristics
- 2.0 Typical Performance Characteristics
- FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample Rate.
- FIGURE 2-2: Integral Nonlinearity (INL) vs. Vref.
- FIGURE 2-3: Integral Nonlinearity (INL) vs. Code (Representative Part).
- FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample Rate (Vdd = 2.7V).
- FIGURE 2-5: Integral Nonlinearity (INL) vs. Vref (Vdd = 2.7V).
- FIGURE 2-6: Integral Nonlinearity (INL) vs. Code (Representative Part, Vdd = 2.7V).
- FIGURE 2-7: Integral Nonlinearity (INL) vs. Temperature.
- FIGURE 2-8: Differential Nonlinearity (DNL) vs. Sample Rate.
- FIGURE 2-9: Differential Nonlinearity (DNL) vs. Vref.
- FIGURE 2-10: Integral Nonlinearity (INL) vs. Temperature (Vdd = 2.7V).
- FIGURE 2-11: Differential Nonlinearity (DNL) vs. Sample Rate (Vdd = 2.7V).
- FIGURE 2-12: Differential Nonlinearity (DNL) vs. Vref (Vdd = 2.7V).
- FIGURE 2-13: Differential Nonlinearity (DNL) vs. Code (Representative Part).
- FIGURE 2-14: Differential Nonlinearity (DNL) vs. Temperature.
- FIGURE 2-15: Gain Error vs. Vref.
- FIGURE 2-16: Differential Nonlinearity (DNL) vs. Code (Representative Part, Vdd = 2.7V).
- FIGURE 2-17: Differential Nonlinearity (DNL) vs. Temperature (Vdd = 2.7V).
- FIGURE 2-18: Offset Error vs. Vref.
- FIGURE 2-19: Gain Error vs. Temperature.
- FIGURE 2-20: Signal to Noise Ratio (SNR) vs. Input Frequency.
- FIGURE 2-21: Total Harmonic Distortion (THD) vs. Input Frequency.
- FIGURE 2-22: Offset Error vs. Temperature.
- FIGURE 2-23: Signal to Noise Ratio and Distortion (SINAD) vs. Input Frequency.
- FIGURE 2-24: Signal to Noise and Distortion (SINAD) vs. Input Signal Level.
- FIGURE 2-25: Effective Number of Bits (ENOB) vs. Vref.
- FIGURE 2-26: Spurious Free Dynamic Range (SFDR) vs. Input Frequency.
- FIGURE 2-27: Frequency Spectrum of 10kHz Input (Representative Part).
- FIGURE 2-28: Effective Number of Bits (ENOB) vs. Input Frequency.
- FIGURE 2-29: Power Supply Rejection (PSR) vs. Ripple Frequency.
- FIGURE 2-30: Frequency Spectrum of 1kHz Input (Representative Part, Vdd = 2.7V).
- FIGURE 2-31: Idd vs. Vdd.
- FIGURE 2-32: Idd vs. Clock Frequency.
- FIGURE 2-33: Idd vs. Temperature.
- FIGURE 2-34: Iref vs. Vdd.
- FIGURE 2-35: Iref vs. Clock Frequency.
- FIGURE 2-36: Iref vs. Temperature.
- FIGURE 2-37: Idds vs. Vdd.
- FIGURE 2-38: Idds vs. Temperature.
- FIGURE 2-39: Analog Input Leakage Current vs. Temperature.
- 3.0 Pin Descriptions
- 4.0 Device Operation
- 5.0 Serial Communications
- 6.0 Applications Information
- 7.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS21293C-page 21
MCP3001
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A – – 1.10
Molded Package Thickness A2 0.75 0.85 0.95
Standoff A1 0.00 – 0.15
Overall Width E 4.90 BSC
Molded Package Width E1 3.00 BSC
Overall Length D 3.00 BSC
Foot Length L 0.40 0.60 0.80
Footprint L1 0.95 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.08 – 0.23
Lead Width b 0.22 – 0.40
D
N
E
E1
NOTE 1
1
2
e
b
A
A1
A2
c
L1
L
φ
Microchip Technology Drawing C04-111
B