MCP434X/436X 7/8-Bit Quad SPI Digital POT with Non-Volatile Memory © 2009 Microchip Technology Inc.
MCP434X/436X Device Block Diagram VDD VSS CS SCK SDI SDO WP RESET Power-up/ Brown-out Control Resistor Network 0 (Pot 0) SPI Serial Interface Module & Control Logic (WiperLock™ Technology) Wiper 0 & TCON0 Register P0A P0W P0B P1A Resistor Network 1 (Pot 1) P1W Wiper 1 & TCON0 Register Memory (16x9) Wiper0 (V & NV) Wiper1 (V & NV) Wiper2 (V & NV) Wiper3 (V & NV) P1B P2A Resistor Network 2 (Pot 2) TCON0 TCON1 STATUS Data EEPROM (5 x 9-bits) P2W Wiper 2 & TCON1 Register P2B P3A Resistor Netwo
MCP434X/436X 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Voltage on VDD with respect to VSS ................ -0.6V to +7.0V Voltage on CS, SCK, SDI, SDI/SDO, WP, and RESET with respect to VSS ................................... -0.6V to 12.5V Voltage on all other pins (PxA, PxW, PxB, and SDO) with respect to VSS ............................ -0.3V to VDD + 0.3V Input clamp current, IIK (VI < 0, VI > VDD, VI > VPP ON HV pins) ......................
MCP434X/436X AC/DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Parameters Sym Min Typ Max Units Conditions Supply Voltage VDD 2.7 — 5.5 V 1.8 — 2.7 V Serial Interface only. VSS — 12.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics Parameters Resistance (± 20%) Resolution Step Resistance Nominal Resistance Match All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym Min RAB 4.0 5 6.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Parameters Sym Min Typ Max Units Full Scale Error (MCP43X1 only) (8-bit code = 100h, 7-bit code = 80h) VWFSE -6.0 -0.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics Parameters All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym Min Typ Max Units Conditions Digital Inputs/Outputs (CS, SDI, SDO, SCK, WP, RESET) V 2.7V ≤ VDD ≤ 5.
MCP434X/436X AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Parameters Sym Min Typ Max Units Weak Pull-up Current IPU — — 1.75 mA Internal VDD pull-up, VIHH pull-down, VDD = 5.
MCP434X/436X 1.1 SPI Mode Timing Waveforms and Requirements RESET tRST tRSTD SCK Wx FIGURE 1-1: TABLE 1-1: RESET Waveforms. RESET TIMING Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) Timing Characteristics Parameters All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C.
MCP434X/436X VIHH VIH VIH CS VIL 84 70 72 SCK 83 71 78 79 80 MSb SDO LSb BIT6 - - - - - -1 77 75, 76 SDI MSb IN BIT6 - - - -1 LSb IN 74 73 FIGURE 1-2: TABLE 1-2: # SPI Timing Waveform (Mode = 11).
MCP434X/436X VIH VIHH VIH 82 CS VIL SCK 84 70 83 71 MSb SDO BIT6 - - - - - -1 LSb 75, 76 73 SDI 80 72 MSb IN 77 BIT6 - - - -1 LSb IN 74 FIGURE 1-3: TABLE 1-3: # SPI Timing Waveform (Mode = 00).
MCP434X/436X TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
MCP434X/436X NOTES: DS22233A-page 16 © 2009 Microchip Technology Inc.
MCP434X/436X 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 0.2 0.1 80 0 60 -0.1 125°C 20 0 -40°C 25°C 85°C -0.2 RW 260 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 180 0 140 RW -40°C 25°C -0.1 -0.2 85°C 20 32 85°C 25°C DNL -40°C -0.75 RW -1.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-12: 5 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-15: 5 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-13: 5 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V) (1 µs/Div). FIGURE 2-16: 5 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V) (1 µs/Div). FIGURE 2-14: 5 kΩ – Power-Up Wiper Response Time (20 ms/Div).
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 125C Rw 125C INL 125C DNL INL DNL 0.2 0.1 80 0 60 -0.1 25°C -40°C 125°C 85°C -0.2 RW 20 -40C Rw -40C INL -40C DNL 260 220 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL DNL 0.1 0 140 100 300 -0.1 RW -0.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-23: 10 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-25: 10 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-24: 10 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V) (1 µs/Div). FIGURE 2-26: 10 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V) (1 µs/Div). © 2009 Microchip Technology Inc.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. INL DNL 0.2 0.1 80 0 60 -0.1 40 125°C 25°C 85°C 20 0 -40°C 120 0.3 100 -0.2 RW -0.3 64 96 128 160 192 224 256 Wiper Setting (decimal) 32 260 220 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL DNL 180 0 140 RW 100 -40°C 60 0 -0.1 40 32 -0.2 1 0.75 0.5 0.25 0 140 RW 100 -0.25 -0.5 -40°C 60 85°C 25°C 20 0 32 64 -0.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-33: 50 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-35: 50 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-34: 50 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V) (1 µs/Div). FIGURE 2-36: 50 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V) (1 µs/Div). © 2009 Microchip Technology Inc.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 125C Rw 125C INL 125C DNL DNL 0 60 -0.1 40 25°C -40°C -40C Rw -40C INL -40C DNL 100 0.1 INL 80 120 0.2 RW -0.2 64 96 128 160 192 224 256 Wiper Setting (decimal) 32 -40C Rw -40C INL -40C DNL 260 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL -0.1 40 -40°C 220 DNL 0.15 0 140 RW 60 -40°C 20 0 32 -0.1 -0.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-43: 100 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-45: 100 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V) (1 µs/Div). FIGURE 2-44: 100 kΩ – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V) (1 µs/Div). FIGURE 2-46: 100 kΩ – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V) (1 µs/Div). © 2009 Microchip Technology Inc.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 2.4 0 -5 2.2 5.5V IOH (mA) VIH (V) 2 1.8 1.6 1.4 2.7V -10 -15 2.7V -20 5.5V -25 -30 -35 1.2 -40 1 -45 -40 0 40 80 -40 120 0 Temperature (°C) FIGURE 2-47: VIH (SDI, SCK, CS, and RESET) vs. VDD and Temperature. 1.3 5.5V IOL (mA) VIL (V) 1.1 1 0.9 0.8 2.7V 0.7 0.6 -40 0 40 80 120 50 45 40 35 30 25 20 15 10 5 0 120 5.5V 2.7V -40 Temperature (°C) FIGURE 2-48: VIL (SDI, SCK, CS, and RESET) vs.
MCP434X/436X Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 4.0 14.2 14.1 3.5 5.5V 3.0 fsck (MHz) tWC (ms) 14.0 2.7V 2.5 2.0 2.7V 13.8 13.7 13.6 5.5V 1.5 13.9 13.5 1.0 13.4 -40 0 40 80 120 -40 Temperature (°C) 0 40 80 120 Temperature (°C) FIGURE 2-51: Nominal EEPROM Write Cycle Time vs. VDD and Temperature. FIGURE 2-53: SCK Input Frequency vs. Voltage and Temperature. 2.1 Test Circuits 2 VDD (V) 1.6 +5V 1.2 VIN 0.8 0.
MCP434X/436X NOTES: DS22233A-page 28 © 2009 Microchip Technology Inc.
MCP434X/436X 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Additional descriptions of the device pins follows.
MCP434X/436X 3.1 Chip Select (CS) The CS pin is the serial interface’s chip select input. Forcing the CS pin to VIL enables the serial commands. Forcing the CS pin to VIHH enables the high-voltage serial commands. 3.2 Serial Data In (SDI) The SDI pin is the serial interfaces Serial Data In pin. This pin is connected to the Host Controllers SDO pin. 3.3 Ground (VSS) The VSS pin is the device ground reference. 3.
MCP434X/436X 4.0 FUNCTIONAL OVERVIEW This Data Sheet covers a family of four non-volatile Digital Potentiometer and Rheostat devices that will be referred to as MCP43XX. The MCP43X1 devices are the Potentiometer configuration, while the MCP43X2 devices are the Rheostat configuration. As the Device Block Diagram shows, there are four main functional blocks.
MCP434X/436X 4.2 Memory Map The device memory is 16 locations that are 9-bits wide (16x9 bits). This memory space contains both volatile and non-volatile locations (see Table 4-1).
MCP434X/436X 4.2.1 NON-VOLATILE MEMORY (EEPROM) 4.2.1.4 This memory can be grouped into two uses of non-volatile memory. These are: • General Purpose Registers • Non-Volatile Wiper Registers The non-volatile wipers starts functioning below the devices VPOR/VBOR trip point. 4.2.1.1 General Purpose Registers These locations allow the user to store up to 5 (9-bit) locations worth of information. 4.2.1.
MCP434X/436X 4.2.2.1 Status (STATUS) Register This register contains 7 status bits. These bits show the state of the WiperLock bits, the Write Protect bit, and if an EEPROM write cycle is active. The STATUS register can be accessed via the READ commands. Register 4-1 describes each STATUS register bit. The STATUS register is placed at Address 05h.
MCP434X/436X REGISTER 4-1: bit 3 WL1: WiperLock Status bit for Resistor Network 1 (Refer to Section 5.3 “WiperLock™ Technology” for further information) The WiperLock Technology bit (WL1) prevents the Volatile and Non-Volatile Wiper 1 addresses and the TCON0 register bits R1HW, R1A, R1W, and R1B from being written to. High Voltage commands are required to enable and disable WiperLock Technology.
MCP434X/436X 4.2.2.2 Terminal Control (TCON) Registers There are two Terminal Control (TCON) Registers. These are called TCON0 and TCON1. Each register contains 8 control bits. Four bits for each Wiper. Register 4-2 describes each bit of the TCON0 register, while Register 4-3 describes each bit of the TCON1 register. The state of each resistor network terminal connection is individually controlled.
MCP434X/436X REGISTER 4-2: TCON0 BITS (1) R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 D8 R1HW R1A R1W R1B R0HW R0A R0W R0B bit 8 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 8 D8: Reserved.
MCP434X/436X REGISTER 4-3: TCON1 BITS (1) R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 D8 R3HW R3A R3W R3B R2HW R2A R2W R2B bit 8 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 8 D8: Reserved.
MCP434X/436X 5.0 RESISTOR NETWORK 5.1 The Resistor Network has either 7-bit or 8-bit resolution. Each Resistor Network allows zero scale to full scale connections. Figure 5-1 shows a block diagram for the resistive network of a device. The Resistor Network is made up of several parts. These include: • Resistor Ladder • Wiper • Shutdown (Terminal Connections) Devices have either four resistor networks. These are referred to as Pot 0, Pot 1 Pot 2, and Pot 3.
MCP434X/436X 5.2 Wiper 5.3 Each tap point (between the RS resistors) is a connection point for an analog switch. The opposite side of the analog switch is connected to a common signal which is connected to the Terminal W (Wiper) pin. A value in the volatile wiper register selects which analog switch to close, connecting the W terminal to the selected node of the resistor ladder. The wiper can connect directly to Terminal B or to Terminal A.
MCP434X/436X Shutdown Shutdown is used to minimize the device’s current consumption. The MCP43XX has one method to achieve this. This is: • Terminal Control Register (TCON) This is different from the MCP42XXX devices in that the Hardware Shutdown Pin (SHDN) has been replaced by a RESET pin. The Hardware Shutdown Pin function is still available via software commands to the TCON register. 5.4.
MCP434X/436X NOTES: DS22233A-page 42 © 2009 Microchip Technology Inc.
MCP434X/436X 6.0 SERIAL INTERFACE (SPI) The MCP43XX devices support the SPI serial protocol. This SPI operates in the slave mode (does not generate the serial clock). The SPI interface uses up to four pins. These are: • • • • CS - Chip Select SCK - Serial Clock SDI - Serial Data In SDO - Serial Data Out Typical SPI Interface is shown in Figure 6-1. In the SPI interface, the Master’s Output pin is connected to the Slave’s Input pin and the Master’s Input pin is connected to the Slave’s Output pin.
MCP434X/436X 6.1 SDI, SDO, SCK, and CS Operation The operation of the four SPI interface pins are discussed in this section. These pins are: • • • • SDI (Serial Data In) SDO (Serial Data Out) SCK (Serial Clock) CS (Chip Select) The serial interface works on either 8-bit or 16-bit boundaries depending on the selected command. The Chip Select (CS) pin frames the SPI commands. 6.1.1 SERIAL DATA IN (SDI) The Serial Data In (SDI) signal is the data signal into the device.
MCP434X/436X 6.2 The SPI Modes 6.2.2 In Mode 1,1: SCK idle state = high (VIH), data is clocked in on the SDI pin on the rising edge of SCK and clocked out on the SDO pin on the falling edge of SCK. The SPI module supports two (of the four) standard SPI modes. These are Mode 0,0 and 1,1. The mode is determined by the state of the SDI pin on the rising edge of the 1st clock bit (of the 8-bit byte). 6.3 6.2.
MCP434X/436X CS VIH VIHH VIL SCK Write to SSPBUF CMDERR bit “1” = Valid Command “0” = Invalid Command SDO bit7 SDI AD3 bit6 AD2 bit5 AD1 bit4 AD0 bit3 C1 bit2 C0 bit1 X bit0 X bit0 bit7 Input Sample FIGURE 6-4: 8-Bit Commands (Increment, Decrement, Modify Write Protect or WiperLock Technology) - SPI Waveform with PIC MCU (Mode 1,1).
MCP434X/436X 7.0 DEVICE COMMANDS 7.1 Command Byte The Command Byte has three fields, the Address, the Command, and 2 Data bits, see Figure 7-1. Currently only one of the data bits is defined (D8). This is for the Write command. The MCP43XX’s SPI command format supports 16 memory address locations and four commands. Each command has two modes.
MCP434X/436X TABLE 7-2: MEMORY MAP AND THE SUPPORTED COMMANDS Address Value Function 00h Volatile Wiper 0 01h Volatile Wiper 1 02h NV Wiper 0 03h NV Wiper 1 Command Data (10-bits) (1) SPI String (Binary) MOSI (SDI pin) MISO (SDO pin) (2) Write Data nn nnnn nnnn 0000 00nn nnnn nnnn 1111 1111 1111 1111 Read Data nn nnnn nnnn 0000 11nn nnnn nnnn 1111 111n nnnn nnnn Increment Wiper — 0000 0100 1111 1111 Decrement Wiper — 0000 1000 1111 1111 Write Data nn nnnn nnnn 0001 00nn nnn
MCP434X/436X 7.2 Data Byte Only the Read Command and the Write Command use the Data Byte, see Figure 7-1. These commands concatenate the 8 bits of the Data Byte with the one data bit (D8) contained in the Command Byte to form 9-bits of data (D8:D0). The Command Byte format supports up to 9-bits of data so that the 8-bit resistor network can be set to Full Scale (100h or greater). This allows wiper connections to Terminal A and to Terminal B.
MCP434X/436X 7.4 Continuous Commands The device supports the ability to execute commands continuously. While the CS pin is in the active state (VIL or VIHH). Any sequence of valid commands may be received. The following example is a valid sequence of events: 1. 2. 3. 4. 5. 6. 7. 8. CS pin driven active (VIL or VIHH). Read Command. Increment Command (Wiper 0). Increment Command (Wiper 0). Decrement Command (Wiper 1). Write Command (Volatile memory). Write Command (Non-Volatile memory).
MCP434X/436X TABLE 7-3: COMMANDS Command Name Write Data Read Data # of Bits 16-Bits 16-Bits Impact on WiperLock or Write Protect Works when Wiper is “locked”? — unlocked (1) No — unlocked (1) No (1) No Operates on High Writes Volatile/ Voltage Value in Non-Volatile (VIHH) on EEPROM CS pin? memory Yes (1) — Both Both Increment Wiper 8-Bits — Volatile Only — unlocked Decrement Wiper 8-Bits — Volatile Only — unlocked (1) No High Voltage Write Data 16-Bits Yes Both Yes uncha
MCP434X/436X 7.5 Write Data Normal and High Voltage 7.5.2 The sequence to write to a single non-volatile memory location is the same as a single write to volatile memory with the exception that after the CS pin is driven inactive (VIH), the EEPROM write cycle (tWC) is started. A write cycle will not start if the write command isn’t exactly 16 clocks pulses. This protects against system issues from corrupting the Non-Volatile memory locations. The Write command is a 16-bit command.
MCP434X/436X 7.5.3 CONTINUOUS WRITES TO VOLATILE MEMORY 7.5.4 Continuous writes are possible only when writing to the volatile memory registers (address 00h, 01h, and 04h). Continuous writes to non-volatile memory are not allowed, and attempts to do so will result in a command error (CMDERR) condition. Figure 7-3 shows the sequence for three continuous writes. The writes do not need to be to the same volatile memory address.
MCP434X/436X 7.6 Read Data Normal and High Voltage 7.6.1 SINGLE READ The read operation requires that the CS pin be in the active state (VILor VIHH). Typically, the CS pin will be in the inactive state (VIH) and is driven to the active state (VILor VIHH). The 16-bit Read Command (Command Byte and Data Byte) is then clocked in on the SCK and SDI pins. The SDO pin starts driving data on the 7th bit (CMDERR bit) and the addressed data comes out on the 8th through 16th clocks.
MCP434X/436X 7.6.2 CONTINUOUS READS Figure 7-5 shows the sequence for three continuous reads. The reads do not need to be to the same memory address. Continuous reads allow the devices memory to be read quickly. Continuous reads are possible to all memory locations. If a non-volatile memory write cycle is occurring, then Read commands may only access the volatile memory locations.
MCP434X/436X 7.7 Increment Wiper Normal and High Voltage The Increment Command is an 8-bit command. The Increment Command can only be issued to volatile memory locations. The format of the command is shown in Figure 7-6. An Increment Command to the volatile memory location changes that location after a properly formatted command (8-clocks) have been received. Increment commands provide a quick and easy method to modify the value of the volatile wiper location by +1 with minimal overhead.
MCP434X/436X 7.7.2 CONTINUOUS INCREMENTS Increment commands can be sent repeatedly without raising CS until a desired condition is met. The value in the Volatile Wiper register can be read using a Read Command and written to the corresponding Non-Volatile Wiper EEPROM using a Write Command. Continuous Increments are possible only when writing to the volatile memory registers (address 00h, and 01h). Figure 7-7 shows a Continuous Increment sequence for three continuous writes.
MCP434X/436X 7.8 Decrement Wiper Normal and High Voltage The Decrement Command is an 8-bit command. The Decrement Command can only be issued to volatile memory locations. The format of the command is shown in Figure 7-6. A Decrement Command to the volatile memory location changes that location after a properly formatted command (8 clocks) have been received. Decrement commands provide a quick and easy method to modify the value of the volatile wiper location by -1 with minimal overhead.
MCP434X/436X 7.8.2 CONTINUOUS DECREMENTS Decrement commands can be sent repeatedly without raising CS until a desired condition is met. The value in the Volatile Wiper register can be read using a Read Command and written to the corresponding Non-Volatile Wiper EEPROM using a Write Command. Continuous Decrements are possible only when writing to the volatile memory registers (address 00h, 01h, and 04h). Figure 7-9 shows a continuous Decrement sequence for three continuous writes.
MCP434X/436X 7.9 Modify Write Protect or WiperLock Technology (High Voltage) Enable and Disable This command is a special case of the High Voltage Decrement Wiper and High Voltage Increment Wiper commands to the non-volatile memory locations 02h, 03h, and 0Fh. This command is used to enable or disable either the software Write Protect, wiper 0, wiper 1, wiper 2 and wiper 3 WiperLock Technology.
MCP434X/436X 8.0 APPLICATIONS EXAMPLES Non-volatile digital potentiometers have a multitude of practical uses in modern electronic circuits. The most popular uses include precision calibration of set point thresholds, sensor trimming, LCD bias trimming, audio attenuation, adjustable power supplies, motor control overcurrent trip setting, adjustable gain amplifiers and offset trimming.
MCP434X/436X 8.2 Techniques to Force the CS Pin to VIHH PIC10F206 The circuit in Figure 8-3 shows a method using the TC1240A doubling charge pump. When the SHDN pin is high, the TC1240A is off, and the level on the CS pin is controlled by the PIC® microcontrollers (MCUs) IO2 pin. When the SHDN pin is low, the TC1240A is on and the VOUT voltage is 2 * VDD. The resistor R1 allows the CS pin to go higher than the voltage such that the PIC MCU’s IO2 pin “clamps” at approximately VDD.
MCP434X/436X 8.4 Design Considerations 8.4.2 In the design of a system with the MCP43XX devices, the following considerations should be taken into account: LAYOUT CONSIDERATIONS Several layout considerations may be applicable to your application. These may include: • Power Supply Considerations • Layout Considerations • Noise • Footprint Compatibility • PCB Area Requirements 8.4.1 8.4.2.
MCP434X/436X MCP43X1 In some applications, PCB area is a criteria for device selection. Table 8-2 shows the package dimensions and area for the different package options. The table also shows the relative area factor compared to the smallest area. For space critical applications, the QFN package would be the suggested package. PACKAGE FOOTPRINT (1) TABLE 8-2: Package Pins MCP42X1 PCB Area Requirements Package Footprint Dimensions (mm) Type Code X Rheostat Devices MCP42X2 MCP43X2 14 TSSOP ST 5.
MCP434X/436X 9.0 DEVELOPMENT SUPPORT 9.1 Development Tools 9.2 Technical Documentation Several additional technical documents are available to assist you in your design and development. These technical documents include Application Notes, Technical Briefs, and Design Guides. Table 9-2 shows some of these documents. Several development tools are available to assist in your design and evaluation of the MCP43XX devices. The currently available tools are shown in Table 9-1.
MCP434X/436X NOTES: DS22233A-page 66 © 2009 Microchip Technology Inc.
MCP434X/436X 10.0 PACKAGING INFORMATION 10.1 Package Marking Information 14-Lead TSSOP Example XXXXXXXX 4362502E YYWW 0940 NNN 256 20-Lead QFN (4x4) XXXXX XXXXXX XXXXXX YYWWNNN 4361 502EML e3 0940 ^^ 256 20-Lead TSSOP Example XXXXXXXX MCP4361 XXXXX NNN YYWW e3 256 EST ^^ 0940 Legend: XX...
MCP434X/436X " # ! 2 & ' !& " & 3 && 144*** ' '4 # * !( 3 ! ! & 3 % & & # & D N E E1 NOTE 1 1 2 e b c φ A2 A A1 5 &! ' ! 6 ' &! 7"') % ! 66 + + 7 7 3 !! & # %% 8 9 :, / 0 ; & # # 3 78 & 8 L L1 = #& < < , , < , + : / 0 # # 3 = #& +
MCP434X/436X Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2009 Microchip Technology Inc.
MCP434X/436X $% " # & ' ( " ) * + +% , &'"! 2 & ' !& " & 3 && 144*** ' '4 # * !( 3 ! ! & 3 D % & & # & D2 EXPOSED PAD e E2 2 E b 2 1 1 K N N NOTE 1 TOP VIEW L BOTTOM VIEW A A1 A3 5 &! ' ! 6 ' &! 7"') % ! 66 + + 7 7 , / 0 & # %% , 0 & & 3 !! - 8 ; & 9 & 8 78 = #& + +$
MCP434X/436X " # 2 & ' !& " & 3 && 144*** ' '4 © 2009 Microchip Technology Inc.
MCP434X/436X $% " # ! 2 & ' !& " & 3 && 144*** ' '4 # * !( 3 ! ! & 3 % & & # & D N E E1 NOTE 1 1 2 e b c φ A2 A A1 L L1 5 &! ' ! 6 ' &! 7"') % ! 66 + + 7 7 :, / 0 ; & # # 3 3 !! & # %% 8 9 & 8 78 = #& < < , , < , + : / 0 # # 3 = #& +
MCP434X/436X Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2009 Microchip Technology Inc.
MCP434X/436X NOTES: DS22233A-page 74 © 2009 Microchip Technology Inc.
MCP434X/436X APPENDIX A: REVISION HISTORY Revision A (December 2009) • Original Release of this Document. © 2009 Microchip Technology Inc.
MCP434X/436X NOTES: DS22233A-page 76 © 2009 Microchip Technology Inc.
MCP434X/436X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP434X/436X NOTES: DS22233A-page 78 © 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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