Datasheet

ManualsBrandsMicrochip ManualsEEPROMEEPROM 8KB 900ns SOT-23

 2002-2012 Microchip Technology Inc. DS21710K-page 1

24AA08/24LC08B

Device Selection Table

Features:

• Single Supply with Operation down to 1.7V for

24AA08 Devices, 2.5V for 24LC08B Devices

• Low-Power CMOS Technology:

- Read current 1 mA, max.

- Standby current 1 A, max.

• 2-Wire Serial Interface, I

C™ Compatible

• Schmitt Trigger inputs for Noise Suppression

• Output Slope Control to eliminate Ground Bounce

• 100 kHz and 400 kHz Clock Compatibility

• Page Write Time 3 ms, typical

• Self-Timed Erase/Write Cycle

• 16-Byte Page Write Buffer

• Hardware Write-Protect

• ESD Protection >4,000V

• More than 1 Million Erase/Write Cycles

• Data Retention >200 Years

• Factory Programming Available

• Packages include 8-lead PDIP, SOIC, TSSOP,

DFN, TDFN, MSOP and 5-lead SOT-23, or 4-lead

Chip Scale

• Pb-Free and RoHS Compliant

• Temperature Ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description:

The Microchip Technology Inc. 24AA08/24LC08B

(24XX08*) is a 8 Kbit Electrically Erasable PROM. The

device is organized as four blocks of 256 x 8-bit

memory with a 2-wire serial interface. Low-voltage

design permits operation down to 1.7V, with standby

and active currents of only 1

A and 1 mA, respectively.

The 24XX08 also has a page write capability for up to

16 bytes of data. The 24XX08 is available in the

standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3

DFN, 2x3 TDFN and MSOP packages, and is also

available in the 5-lead SOT-23, or 4-lead Chip Scale

package. All packages are Pb-free and RoHS

compliant.

Block Diagram

Package Types

Part

Number

VCC

Range

Max. Clock

Frequency

Temp.

Ranges

24AA08 1.7-5.5 400 kHz

(1)

24LC08B 2.5-5.5 400 kHz I, E

Note 1: 100 kHz for VCC <2.5V.

EEPROM

Array

Page

YDEC

XDEC

Sense Amp.

Memory

Control

Logic

I/O

Control

Logic

I/O

SDA

SCL

VSS

R/W Control

Latches

Generator

Note: Pins A0, A1 and A2 are not used by the 24XX08. (No

internal connections).

VCC

SCL

SDA

PDIP/MSOP/SOIC/TSSOP

DFN/TDFN

SCL

SDA

SOT-23-5

SCL

Vss

SDA

Vcc

CS (Chip Scale)

SDA

SCL

VSS

(Top Down View,

Balls Not Visible)

8K I

C™ Serial EEPROM

Summary of content (40 pages)

PAGE 1
24AA08/24LC08B 8K I2C™ Serial EEPROM Device Selection Table Part Number 24AA08 24LC08B Note 1: Description: VCC Range Max. Clock Frequency Temp. Ranges 1.7-5.5 400 kHz(1) I 2.5-5.5 400 kHz I, E The Microchip Technology Inc. 24AA08/24LC08B (24XX08*) is a 8 Kbit Electrically Erasable PROM. The device is organized as four blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.
PAGE 2
4AA08/24LC08B 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ..........................................................................
PAGE 3
24AA08/24LC08B TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param. Symbol No. Characteristic VCC = +1.7V to +5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Min. Typ. Max. Units Conditions 1 FCLK Clock frequency — — — — 400 100 kHz 2.5V  VCC  5.5V 1.7V  VCC  2.5V (24AA08) 2 THIGH Clock high time 600 4000 — — — — ns 2.5V  VCC  5.5V 1.7V  VCC  2.5V (24AA08) 3 TLOW Clock low time 1300 4700 — — — — ns 2.5V  VCC  5.5V 1.7V  VCC  2.
PAGE 4
24AA08/24LC08B FIGURE 1-1: BUS TIMING DATA 5 4 2 3 SCL 7 SDA IN 8 6 10 9 14 12 11 SDA OUT FIGURE 1-2: BUS TIMING START/STOP D3 SCL 6 7 10 SDA Start DS21710K-page 4 Stop  2002-2012 Microchip Technology Inc.
PAGE 5
24AA08/24LC08B 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
PAGE 6
24AA08/24LC08B 3.0 FUNCTIONAL DESCRIPTION The 24XX08 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX08 works as slave.
PAGE 7
24AA08/24LC08B 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a four-bit control code. For the 24XX08, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the block-select bits (B2, B1, B0). B2 is a “don’t care” for the 24XX08.
PAGE 8
24AA08/24LC08B 6.0 WRITE OPERATION 6.1 Byte Write words prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received an internal write cycle will begin (Figure 6-2). Following the Start condition from the master, the device code (4 bits), the block address (3 bits) and the R/W bit, which is a logic-low, is placed onto the bus by the master transmitter.
PAGE 9
24AA08/24LC08B 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0).
PAGE 10
24AA08/24LC08B 8.0 READ OPERATION 8.3 Sequential Read Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. Sequential reads are initiated in the same way as a random read, except that once the 24XX08 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read.
PAGE 11
24AA08/24LC08B FIGURE 8-2: RANDOM READ Bus Activity Master SDA Line S T Control A Byte R T S 1 0 1 0 X B1B00 Control Byte A C K A Block C Select K Bits x = “don’t care” FIGURE 8-3: Bus Activity Master SDA Line Bus Activity S T O P P Data (n) S 1 0 1 0 X B1B0 1 A Block C Select K Bits Bus Activity S T A R T Word Address (n) N o A C K SEQUENTIAL READ Control Byte Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + X) P 1 A C K  2002-2012 Microchip Technology Inc.
PAGE 12
24AA08/24LC08B 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXX T/XXYYWW NNN 8-Lead TSSOP 24LC08B I/P e3 13F 0527 Example: 24LC08BI SN e3 0527 13F Example: XXXX 4L08 TYWW I527 NNN 13F 8-Lead MSOP Example: XXXXXT YWWNNN 4L8BI 52713F 5-Lead SOT-23 Example: XXNN DS21710K-page 12 Example: M43F  2002-2012 Microchip Technology Inc.
PAGE 13
24AA08/24LC08B 8-Lead 2x3 DFN Example: XXX YWW NN 244 527 13 8-Lead 2x3 TDFN Example: XXX YWW NN A44 527 13 Example: 4-Lead Chip Scale XN 43 1st Line Marking MSOP SOT-23 DFN TDFN Part No. TSSOP 24AA08 4A08 4A08T B4NN — 241 — A41 — 24LC08B 4L08 4L8BT M4NN N4NN 244 245 A44 A45 Legend: XX...
PAGE 14
24AA08/24LC08B 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 6 &! ' ! 9 ' &! 7"') % ! 7,8. 7 7 & ; < & & 7: 1 , = = - 1 ! & & = = .
PAGE 15
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2012 Microchip Technology Inc.
PAGE 16
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 16  2002-2012 Microchip Technology Inc.
PAGE 17
24AA08/24LC08B ! "" #$ %& ! ' 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4  2002-2012 Microchip Technology Inc.
PAGE 18
24AA08/24LC08B () )" * ! ( +%+ ( ! 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 6 &! ' ! 9 ' &! 7"') % ! 99 . . 7 7 7: ; < & : 8 & = = < = # # 4 4 !! & # %% ? 1 , : > #& . # # 4 > #& .
PAGE 19
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2012 Microchip Technology Inc.
PAGE 20
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 20  2002-2012 Microchip Technology Inc.
PAGE 21
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2012 Microchip Technology Inc.
PAGE 22
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 22  2002-2012 Microchip Technology Inc.
PAGE 23
24AA08/24LC08B , ! (" " !( !( - 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 6 &! ' ! 9 ' &! 7"') % ! 99 . . 7 7: ; 7 9 # & 1 , :"&! # 9 # & : 8 & = < = - = : > #& . = - # # 4 > #& .
PAGE 24
AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 24  2002-2012 Microchip Technology Inc.
PAGE 25
24AA08/24LC08B . $ * / 0' -1 1 %& . 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 6 &! ' ! 9 ' &! 7"') % ! 99 . .
PAGE 26
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 26  2002-2012 Microchip Technology Inc.
PAGE 27
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2012 Microchip Technology Inc.
PAGE 28
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 28  2002-2012 Microchip Technology Inc.
PAGE 29
24AA08/24LC08B . $ * / 0 -1 1 %2, ( . 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4  2002-2012 Microchip Technology Inc.
PAGE 30
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 30  2002-2012 Microchip Technology Inc.
PAGE 31
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2012 Microchip Technology Inc.
PAGE 32
24AA08/24LC08B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21710K-page 32  2002-2012 Microchip Technology Inc.
PAGE 33
24AA08/24LC08B APPENDIX A: REVISION HISTORY Revision C (12/2003) Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC08B standard marking code. Revision D (02/2005) Added DFN package. Revision E (09/2005) Revised Figure 3-1: Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 Current Address Read; Figure 72 Random Read; Figure 7-3 Sequential Read; 8.3 Write-Protect (000-3FF).
PAGE 34
24AA08/24LC08B NOTES: DS21710K-page 34  2002-2012 Microchip Technology Inc.
PAGE 35
24AA08/24LC08B THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
PAGE 36
24AA08/24LC08B READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 37
24AA08/24LC08B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device: X Note 1: Examples: Temperature Package Range I2C 24AA08: 24AA08T: = 1.7V, 8 Kbit Serial EEPROM = 1.7V, 8 Kbit I2C Serial EEPROM (Tape and Reel) 24LC08B: = 2.5V, 8 Kbit I2C Serial EEPROM 24LC08BT: = 2.
PAGE 38
24AA08/24LC08B NOTES: DS21710K-page 38  2002-2012 Microchip Technology Inc.
PAGE 39
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 40
Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.