Datasheet

ManualsBrandsMicrochip ManualsEEPROMEEPROM 256KB 900ns NSOIC

 2004 Microchip Technology Inc. DS21203M-page 1

24AA256/24LC256/24FC256

Device Selection Table

Features

• Low-power CMOS technology:

- Maximum write current 3 mA at 5.5V

- Maximum read current 400 µA at 5.5V

- Standby current 100 nA typical at 5.5V

• 2-wire serial interface bus, I

™

compatible

• Cascadable for up to eight devices

• Self-timed erase/write cycle

• 64-byte Page Write mode available

• 5 ms max. write cycle time

• Hardware write-protect for entire array

• Output slope control to eliminate ground bounce

• Schmitt Trigger inputs for noise suppression

• 1,000,000 erase/write cycles

• Electrostatic discharge protection > 4000V

• Data retention > 200 years

• 8-pin PDIP, SOIC, TSSOP, MSOP and DFN

packages, 14-lead TSSOP package

• Standard and Pb-free finishes available

• Temperature ranges:

Description

The Microchip Technology Inc. 24AA256/24LC256/

24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial

Electrically Erasable PROM, capable of operation

across a broad voltage range (1.8V to 5.5V). It has

been developed for advanced, low-power applications

such as personal communications or data acquisition.

This device also has a page write capability of up to 64

bytes of data. This device is capable of both random

and sequential reads up to the 256K boundary.

Functional address lines allow up to eight devices on

the same bus, for up to 2 Mbit address space. This

device is available in the standard 8-pin plastic DIP,

SOIC, TSSOP, MSOP, DFN and 14-lead TSSOP

packages.

Block Diagram

Package Types

*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.

Part

Number

VCC

Range

Max. Clock

Frequency

Temp.

Ranges

24AA256 1.8-5.5V 400 kHz

(1)

24LC256 2.5-5.5V 400 kHz I, E

24FC256 1.8-5.5V 1 MHz

(2)

Note 1: 100 kHz for VCC < 2.5V.

2: 400 kHz for VCC < 2.5V.

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

HV Generator

EEPROM

Array

Page Latches

YDEC

XDEC

Sense Amp.

R/W Control

Memory

Control

Logic

I/O

Control

Logic

I/O

A0 A1A2

SDA

SCL

VSS

VCC

SCL

SDA

24XX256

PDIP/SOIC TSSOP/MSOP *

SCL

SDA

TSSOP

24XX256

DFN

SCL

SDA

24XX256

VCC

SCL

SDA

24XX256

Note: * Pins A0 and A1 are no connects for the MSOP package only.

256K I

™

CMOS Serial EEPROM

Summary of content (29 pages)

PAGE 1
24AA256/24LC256/24FC256 256K I2C™ CMOS Serial EEPROM Device Selection Table Description Part Number VCC Range Max. Clock Frequency 24AA256 1.8-5.5V 400 kHz(1) I 24LC256 2.5-5.5V 400 kHz I, E 24FC256 1.8-5.5V 1 MHz(2) I Note 1: 2: The Microchip Technology Inc. 24AA256/24LC256/ 24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.8V to 5.5V).
PAGE 2
4AA256/24LC256/24FC256 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ..................................................................
PAGE 3
24AA256/24LC256/24FC256 TABLE 1-2: AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V Automotive (E): VCC = +2.5V to 5.5V AC CHARACTERISTICS Param. No. Sym Characteristic Min Max Units TA = -40°C to +85°C TA = -40°C to +125°C Conditions 1 FCLK Clock frequency — — — — 100 400 400 1000 kHz 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 2 THIGH Clock high time 4000 600 600 500 — — — — ns 1.8V ≤ VCC < 2.5V 2.
PAGE 4
24AA256/24LC256/24FC256 Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V Automotive (E): VCC = +2.5V to 5.5V AC CHARACTERISTICS (Continued) Param. No. Sym Characteristic TA = -40°C to +85°C TA = -40°C to +125°C Min Max Units Conditions — — — — 3500 900 900 400 ns 1.8 V ≤ VCC < 2.5V 2.5 V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5 V ≤ VCC ≤ 5.5V 24FC256 4700 1300 1300 500 — — — — ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 10 + 0.
PAGE 5
24AA256/24LC256/24FC256 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
PAGE 6
24AA256/24LC256/24FC256 4.0 BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line, while the clock line is high, will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 4-1). 4.1 Bus not Busy (A) Both data and clock lines remain high. 4.
PAGE 7
24AA256/24LC256/24FC256 FIGURE 4-1: (A) DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (D) Start Condition Address or Acknowledge Valid (D) (C) (A) SCL SDA FIGURE 4-2: Data Allowed to Change Stop Condition ACKNOWLEDGE TIMING Acknowledge Bit SCL SDA 1 2 3 4 5 6 7 Data from transmitter Transmitter must release the SDA line at this point, allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data.  2004 Microchip Technology Inc.
PAGE 8
24AA256/24LC256/24FC256 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a 4-bit control code. For the 24XX256, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX256 devices on the same bus and are used to select which device is accessed.
PAGE 9
24AA256/24LC256/24FC256 6.0 WRITE OPERATIONS 6.1 Byte Write pointer bits are internally incremented by one. If the master should transmit more than 64 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2).
PAGE 10
24AA256/24LC256/24FC256 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition, followed by the control byte for a Write command (R/W = 0).
PAGE 11
24AA256/24LC256/24FC256 8.0 READ OPERATION 8.2 Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24XX256 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set.
PAGE 12
24AA256/24LC256/24FC256 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX T/XXYYWW NNN 8-Lead SOIC (208 mil) XXXXXXXX T/XXXXXX YYWWNNN 8-Lead TSSOP Example: 24AA256 I/P017 0310 Example: 24LC256 I/SN0310 017 Example: 24LC256 I/SM 0310017 Example: XXXX TYWW NNN Legend: XX...
PAGE 13
24AA256/24LC256/24FC256 Package Marking Information (Continued) 8-Lead MSOP Example: XXXXXT YWWNNN 4L256I 101017 8-Lead DFN-S Example: 24LC256 I/MF YYWW NNN XXXXXXX T/XXXXX YYWW NNN 14-Lead TSSOP Example: XXXXXXXT YYWW NNN 24LC256I 0110 017 TSSOP Package Codes MSOP Package Codes Part No. STD Pb-free STD Pb-free 24AA256 4AD G4AD 4A256 G4AD 24LC256 4LD G4LD 4L256 G4LD 24FC256 4FD G4FD 4F256 G4FD  2004 Microchip Technology Inc.
PAGE 14
24AA256/24LC256/24FC256 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c
PAGE 15
24AA256/24LC256/24FC256 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .
PAGE 16
24AA256/24LC256/24FC256 8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC) E E1 p D 2 1 n B α c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L φ c B α β MIN .070 .069 .002 .300 .201 .202 .020 0 .008 .014 0 0 INCHES* NOM 8 .050 .075 .074 .005 .313 .208 .205 .025 4 .
PAGE 17
24AA256/24LC256/24FC256 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 A2 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN INCHES NOM MAX 8 .026 .033 .002 .246 .
PAGE 18
24AA256/24LC256/24FC256 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN .033 .002 .246 .169 .193 .020 0 .004 .
PAGE 19
24AA256/24LC256/24FC256 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .
PAGE 20
24AA256/24LC256/24FC256 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) E p B E1 n L R D1 1 D D2 PIN 1 ID EXPOSED METAL PADS 2 E2 TOP VIEW BOTTOM VIEW α A2 A3 A A1 INCHES Units Dimension Limits Number of Pins MIN MILLIMETERS* NOM n MAX NOM MIN MAX 8 8 Pitch p Overall Height A .033 .039 0.85 1.00 Molded Package Thickness A2 .026 .031 0.65 0.80 Standoff A1 .0004 .002 0.01 0.05 Base Thickness A3 .008 REF. 0.20 REF. 4.92 BSC .050 BSC .
PAGE 21
24AA256/24LC256/24FC256 APPENDIX A: REVISION HISTORY Revision L Corrections to Section 1.0, Electrical Characteristics. Revision M Added 1.8V 400 kHz option for 24FC256.  2004 Microchip Technology Inc.
PAGE 22
24AA256/24LC256/24FC256 NOTES: DS21203M-page 22  2004 Microchip Technology Inc.
PAGE 23
24AA256/24LC256/24FC256 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site.
PAGE 24
AA256/24LC256/24FC256 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 25
24AA256/24LC256/24FC256 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X Device Device: Temperature Range 24AA256: 24AA256T: 24LC256: 24LC256T: 24FC256: 24FC256T: Temperature Range: I E Package: P = SN = SM = ST = ST14 = MF = MS Lead Finish = = /XX X Package Lead Finish 256 Kbit 1.8V I2C Serial EEPROM 256 Kbit 1.8V I2C Serial EEPROM Tape and Reel) 256 Kbit 2.5V I2C Serial EEPROM 256 Kbit 2.
PAGE 26
24AA256/24LC256/24FC256 NOTES: DS21203M-page 26  2004 Microchip Technology Inc.
PAGE 27
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 28
WORLDWIDE SALES AND SERVICE AMERICAS China - Beijing Korea Corporate Office Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Chengdu 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 2355 West Chandler Blvd.
PAGE 29
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