Datasheet

ManualsBrandsMicrochip ManualsEEPROMEEPROM 256KB 900ns TSSOP

 1998-2019 Microchip Technology Inc. DS20001203W-page 1

24AA256/24LC256/24FC256

Device Selection Table

Features

• Single Supply with Operation Down to 1.7V for

24AA256 and 24FC256 Devices, 2.5V for

24LC256 Devices

• Low-Power CMOS Technology:

- Write current: 3 mA, maximum

- Standby current: 1 µA maximum (I-temp.)

• Two-Wire Serial Interface, I

C Compatible

• Cascadable up to Eight Devices

• Schmitt Trigger Inputs for Noise Suppression

• Output Slope Control to Eliminate Ground Bounce

• 100 kHz, 400 kHz and 1 MHz Compatibility

• Page Write Time: 5 ms, maximum

• Self-Timed Erase/Write Cycle

• 64-Byte Page Write Buffer

• Hardware Write-Protect

• ESD Protection >4000V

• More than One Million Erase/Write Cycles

• Data Retention >200 years

• Factory Programming Available

• RoHS Compliant

• Temperature Ranges:

• Automotive AEC-Q100 Qualified

Packages

• 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP,

8-Lead SOIC, 8-Lead SOIJ, 8-Lead TDFN,

8-Lead TSSOP and 8-Ball CSP

Description

The Microchip Technology Inc. 24XX256

(1)

is a 32K x 8

(256 Kbit) Serial Electrically Erasable PROM, capable

of operation across a broad voltage range (1.7V to

5.5V). It has been developed for advanced, low-power

applications such as personal communications or data

acquisition. This device also has a page write capability

of up to 64 bytes of data. This device is capable of both

random and sequential reads up to the 256K boundary.

Functional address lines allow up to eight devices on

the same bus, for up to 2 Mbit address space.

Package Types

Part Number VCC Range Max. Clock Frequency Temp. Ranges Available Packages

24AA256 1.7V-5.5V 400 kHz

(1)

I, E MF, MS, P, SN, SM, MNY, ST, CS

24LC256 2.5V-5.5V 400 kHz I, E MF, MS, P, SN, SM, MNY, ST

24FC256 1.7V-5.5V 1 MHz

(2)

I MF, MS, P, SN, SM, MNY, ST

Note 1: 100 kHz for VCC <2.5V.

2: 400 kHz for VCC <2.5V.

- Industrial (I): -40C to +85C

- Extended (E): -40C to +125C

Note 1: 24XX256 is used in this document as a

generic part number for the 24AA256/

24LC256/24FC256 devices.

8-Ball CSP

CC A1 A0

WP A2

SDA SCL V

8-Lead SOIC/SOIJ/TSSOP

8-Lead DFN/TDFN

VSS

SCL

SDA

(Top View)

8-Lead PDIP/MSOP

(Top View)

SCL

SDA

SCL

SDA

24XX256

(Top View)

Note 1: Pins A0 and A1 are no connects for the MSOP package only.

(1)

256K I

C Serial EEPROM

Summary of content (42 pages)

PAGE 1
24AA256/24LC256/24FC256 256K I2C Serial EEPROM Device Selection Table Part Number VCC Range Max. Clock Frequency 24AA256 1.7V-5.5V 24LC256 2.5V-5.5V 400 kHz 1.7V-5.5V MHz(2) 24FC256 Note 1: 2: 400 1 Temp. Ranges kHz(1) Available Packages I, E MF, MS, P, SN, SM, MNY, ST, CS I, E MF, MS, P, SN, SM, MNY, ST I MF, MS, P, SN, SM, MNY, ST 100 kHz for VCC < 2.5V. 400 kHz for VCC < 2.5V. Features Packages • Single Supply with Operation Down to 1.7V for 24AA256 and 24FC256 Devices, 2.
PAGE 2
4AA256/24LC256/24FC256 Block Diagram A0 A1A2 WP I/O Control Logic Memory Control Logic HV Generator XDEC EEPROM Array Page Latches I/O SCL YDEC SDA VCC VSS DS20001203W-page 2 Sense Amp. R/W Control  1998-2019 Microchip Technology Inc.
PAGE 3
24AA256/24LC256/24FC256 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VCC +1.0V Storage temperature ...................................................................
PAGE 4
24AA256/24LC256/24FC256 TABLE 1-2: AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V Extended (E): VCC = +1.7V to 5.5V AC CHARACTERISTICS Param. Symbol No.
PAGE 5
24AA256/24LC256/24FC256 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS (Continued) Param. Symbol No. 11 Characteristic TSU:WP WP Setup Time 12 THD:WP WP Hold Time 13 TAA 14 TBUF 15 TOF Output Valid from Clock Bus Free Time: The time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum CB  100 pF Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V Extended (E): VCC = +1.7V to 5.5V Min. Max. Units 4000 — ns 1.
PAGE 6
24AA256/24LC256/24FC256 FIGURE 1-1: BUS TIMING DATA 5 SCL 7 SDA IN 3 4 D3 2 8 10 9 6 16 14 13 SDA OUT WP DS20001203W-page 6 (protected) (unprotected) 11 12  1998-2019 Microchip Technology Inc.
PAGE 7
24AA256/24LC256/24FC256 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
PAGE 8
24AA256/24LC256/24FC256 3.0 FUNCTIONAL DESCRIPTION The 24XX256 supports a bidirectional two-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter and a device receiving data as a receiver. The bus must be controlled by a master device which generates the Serial Clock (SCL), controls the bus access, and generates the Start and Stop conditions while the 24XX256 works as a slave.
PAGE 9
24AA256/24LC256/24FC256 FIGURE 4-1: (A) DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (D) Start Condition Address or Acknowledge Valid (D) (C) (A) SCL SDA FIGURE 4-2: Stop Condition Data Allowed to Change ACKNOWLEDGE TIMING Acknowledge Bit SCL SDA 1 2 3 4 5 6 7 Data from transmitter Transmitter must release the SDA line at this point, allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data.  1998-2019 Microchip Technology Inc.
PAGE 10
24AA256/24LC256/24FC256 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device. The control byte consists of a 4-bit control code. For the 24XX256, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX256 devices on the same bus and are used to select which device is accessed.
PAGE 11
24AA256/24LC256/24FC256 6.0 WRITE OPERATIONS 6.1 Byte Write Following the Start condition from the master, the control code (four bits), the Chip Select (three bits) and the R/W bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow after it has generated an Acknowledge bit during the ninth clock cycle.
PAGE 12
24AA256/24LC256/24FC256 FIGURE 6-1: BYTE WRITE SDA Line S T A R T Bus Activity AA S101 0A 2 10 0 Bus Activity Master Control Byte Bus Activity Master SDA Line Bus Activity S T O P Data P A C K A C K A C K PAGE WRITE S T A R T Control Byte Address High Byte AAA S10102 1 00 x = “don’t care” bit 7.
PAGE 13
24AA256/24LC256/24FC256 8.0 READ OPERATION 8.2 Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24XX256 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the Acknowledge. This terminates the write operation, but not before the internal Address Pointer is set.
PAGE 14
24AA256/24LC256/24FC256 FIGURE 8-3: Bus Activity Master SEQUENTIAL READ Control Byte Data (n) Data (n + 1) S T O P Data (n + x) Data (n + 2) P SDA Line Bus Activity DS20001203W-page 14 A C K A C K A C K A C K N O A C K  1998-2019 Microchip Technology Inc.
PAGE 15
24AA256/24LC256/24FC256 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead DFN-S Example XXXXXXX XXXXXXX YYWW NNN 24LC256 I/MF e3 1926 13F 8-Lead MSOP Example XXXXXX YWWNNN 4L256I 92613F 8-Lead PDIP (300 mil) Example XXXXXXXX XXXXXNNN YYWW 24AA256 I/P e3 13F 1926 8-Lead SOIC (3.90 mm) Example XXXXXXXX XXXXYYWW NNN 24LC256I SN e3 1926 13F 8-Lead SOIJ (5.28 mm) Example XXXXXXXX XXXXXXXX YYWWNNN  1998-2019 Microchip Technology Inc.
PAGE 16
24AA256/24LC256/24FC256 Package Marking Information (Continued) 8-Lead TDFN Example XXX YWW NN EF4 1926 13 8-Lead TSSOP Example XXXX XYWW NNN 4LD I926 13F Example 8-Lead Chip Scale 249 A192 613F XXX XYYW WNNN 1st Line Marking Codes Part No. DFN MSOP 24AA256 24AA256 4A256T(1) 24LC256 24LC256 4L256T(1) 24LC256 24FC256 24FC256 4F256T(1) Note 1: PDIP SOIC SOIJ TDFN TSSOP CSP 4AD 249 I-Temp. E-Temp.
PAGE 17
24AA256/24LC256/24FC256 $ ! "# 3 & ' !& " & + && 244*** ' '4 # * !( + ! ! & + % & & # & e D L b N N K E2 E EXPOSED PAD NOTE 1 1 2 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 5 &! ' ! 6 ' &! 7"') % ! 66 - - 7 7 ; & 9 : & 8 78 0 1 : :/ & # %% / 1 & & +
PAGE 18
24AA256/24LC256/24FC256 $ 3 & ' !& " & + && 244*** ' '4 DS20001203W-page 18 # * !( + ! ! & + % & & # &  1998-2019 Microchip Technology Inc.
PAGE 19
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 20
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203W-page 20  1998-2019 Microchip Technology Inc.
PAGE 21
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 22
24AA256/24LC256/24FC256 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 DS20001203W-page 22  1998-2019 Microchip Technology Inc.
PAGE 23
24AA256/24LC256/24FC256 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 24
AA256/24LC256/24FC256 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NX b 0.25 C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A–A 0.23 L (L1) VIEW C Microchip Technology Drawing No.
PAGE 25
24AA256/24LC256/24FC256 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 26
24AA256/24LC256/24FC256 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.
PAGE 27
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 28
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203W-page 28  1998-2019 Microchip Technology Inc.
PAGE 29
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 30
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203W-page 30  1998-2019 Microchip Technology Inc.
PAGE 31
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 32
24AA256/24LC256/24FC256 $ % & '() !* # 3 & ' !& " & + && 244*** ' '4 DS20001203W-page 32 # * !( + ! ! & + % & & # &  1998-2019 Microchip Technology Inc.
PAGE 33
24AA256/24LC256/24FC256 $ *+ , "+- , " . , "* /(/ !*"".
PAGE 34
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203W-page 34  1998-2019 Microchip Technology Inc.
PAGE 35
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 36
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001203W-page 36  1998-2019 Microchip Technology Inc.
PAGE 37
24AA256/24LC256/24FC256 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  1998-2019 Microchip Technology Inc.
PAGE 38
24AA256/24LC256/24FC256 APPENDIX A: REVISION HISTORY Revision W (08/2019) Updated content throughout for clarification. Revision V (08/2018) Updated First Line Marking Codes table. Revision U (11/2013) Updated ICCS. Revision T (04/2013) Added TDFN Package. Revision S (12/2012) Revise Automotive E-temp. Revision R (07/2011) Added Chip Scale package. Revision Q (05/10) Revised Table 1-1, Table 1-2, Section 6.1; Updated Package Drawings. Revision P Revised Features; Changed 1.8V voltage to 1.
PAGE 39
24AA256/24LC256/24FC256 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers.
PAGE 40
24AA256/24LC256/24FC256 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X] PART NO. Device (1) Tape and Reel Option -X /XX Temperature Range Package 1.7V, 256-Kbit I2C Serial EEPROM 2.5V, 256-Kbit I2C Serial EEPROM 1.
PAGE 41
24AA256/24LC256/24FC256 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 42
Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.