Datasheet

© 2007 Microchip Technology Inc. DS21826B-page 17
MCP1700
3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN MAX
Number of Leads N 3
Pitch e 1.50 BSC
Outside Lead Pitch e1 3.00 BSC
Overall Height A 1.40 1.60
Overall Width H 3.94 4.25
Molded Package Width at Base E 2.29 2.60
Molded Package Width at Top E1 2.13 2.29
Overall Length D 4.39 4.60
Tab Length D1 1.40 1.83
Foot Length L 0.79 1.20
Lead Thickness c 0.35 0.44
Lead 2 Width b 0.41 0.56
Leads 1 & 3 Width b1 0.36 0.48
D
D1
E
H
N
b1
e1
b
21
e
b1
L
A
C
E1
Microchip Technology Drawing C04-029B