Datasheet

MCP1700
DS21826B-page 18 © 2007 Microchip Technology Inc.
3-Lead Plastic Transistor Outline (TO or ZB) [TO-92]
Notes:
1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN MAX
Number of Pins N 3
Pitch e .050 BSC
Bottom to Package Flat D .125 .165
Overall Width E .175 .205
Overall Length A .170 .210
Molded Package Radius R .080 .105
Tip to Seating Plane L .500 –
Lead Thickness c .014 .021
Lead Width b .014 .022
E
A
N
1
L
b
e
c
R
D
1
2
3
Microchip Technology Drawing C04-101B