Datasheet

© 2008 Microchip Technology Inc. DS22058C-page 19
MCP6V01/2/3
3.0 PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Analog Outputs
The analog output pins (V
OUT
) are low-impedance
voltage sources.
3.2 Analog Inputs
The non-inverting and inverting inputs (V
IN
+, V
IN
–, …)
are high-impedance CMOS inputs with low bias
currents.
3.3 Power Supply Pins
The positive power supply (V
DD
) is 1.8V to 5.5V higher
than the negative power supply (V
SS
). For normal
operation, the other pins are between V
SS
and V
DD
.
Typically, these parts are used in a single (positive)
supply configuration. In this case, V
SS
is connected to
ground and V
DD
is connected to the supply. V
DD
will
need bypass capacitors.
3.4 Chip Select (CS) Digital Input
This pin (CS) is a CMOS, Schmitt-triggered input that
places the MCP6V03 op amps into a low power mode
of operation.
3.5 Exposed Thermal Pad (EP)
There is an internal connection between the Exposed
Thermal Pad (EP) and the V
SS
pin; they must be con-
nected to the same potential on the Printed Circuit
Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
θ
JA
).
MCP6V01 MCP6V02 MCP6V03
Symbol Description
TDFN SOIC DFN SOIC TDFN SOIC
661166V
OUT
, V
OUTA
Output (op amp A)
222222V
IN
–, V
INA
– Inverting Input (op amp A)
333333V
IN
+, V
INA
+ Non-inverting Input
(op amp A)
444444 V
SS
Negative Power Supply
—— 5 5 —— V
INB
+ Non-inverting Input
(op amp B)
—— 6 6 —— V
INB
– Inverting Input (op amp B)
—— 7 7 —— V
OUTB
Output (op amp B)
778877 V
DD
Positive Power Supply
————— 8 CS
Chip Select (op amp A)
1, 5, 8 1, 5, 8 — — 1, 5, 8 1, 5 NC No Internal Connection
9 — 9 — 9 — EP Exposed Thermal Pad (EP);
must be connected to V
SS