Datasheet

© 2008 Microchip Technology Inc. DS22058C-page 41
MCP6V01/2/3
APPENDIX A: REVISION HISTORY
Revision C (December 2008)
The following is the list of modifications:
1. Added the 8-lead, 2x3 TDFN package for the
MCP6V01 and MCP6V03 devices.
2. Corrected the IMD specification in Table 1-2.
3. Added 8-lead, 2x3 TDFN package information to
Thermal Characteristic table.
4. Added information on the Exposed Thermal Pad
(EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4
DFN packages.
5. Added Section 4.3.6 “Stabilizing Output
Loads”
6. Other minor typographical corrections.
Revision B (June 2008)
The following is the list of modifications:
1. Updated the specifications and their conditions.
2. Corrected the Timing Diagrams.
3. Added to the Test Circuits.
4. Added R
ISO
(see Figure 4-6) to all circuit
diagrams.
5. Added the Typical Performance Curves.
6. Corrected and expanded Applications
Information.
7. Minor edits due to change in production status.
8. Added Appendix B, Offset Related Test
Screens.
Revision A (September 2007)
• Original Release of this Document.