Datasheet

© 2008 Microchip Technology Inc. DS22058C-page 43
MCP6V01/2/3
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP6V01 Single Op Amp
MCP6V01T Single Op Amp
(Tape and Reel for 2x3 TDFN andSOIC)
MCP6V02 Dual Op Amp
MCP6V02T Dual Op Amp
(Tape and Reel for 4×4 DFN and SOIC)
MCP6V03 Single Op Amp with Chip Select
MCP6V03T Single Op Amp with Chip Select
(Tape and Reel for SOIC)
Temperature Range: E = -40°C to +125°C
Package: MD = Plastic Dual Flat, No-Lead (4×4x0.9 mm), 8-lead
(MCP6V02 only)
MNY * = Plastic Dual Flat No Lead (2x3x0.75 mm), 8-lead
(MCP6V01, MCP6V03)
SN = Plastic SOIC (150mil Body), 8-lead
* Y = nickel palladium gold manufacturing designator. Only
available on the TDFN package.
PART NO. –X /XXX
PackageTemperature
Range
Device
Examples:
a) MCP6V01T-E/SN: Extended temperature,
8LD SOIC package.
b) MCP6V01-E/MNY:Extended temperature,
8LD 2x3 TDFN package.
a) MCP6V02-E/MD: Extended temperature,
8LD 4x4 DFN package.
b) MCP6V02T-E/SN: Tape and Reel,
Extended temperature,
8LD SOIC package.
a) MCP6V03-E/SN: Extended temperature,
8LD SOIC package.
b) MCP6V03-E/MNY:Extended temperature,
8LD 2x3 TDFN package.